Polishing Apparatus with Movable Surface-Property Measuring Device
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Solution Overview
Problem
Conventional polishing apparatuses require manual attachment and detachment of surface-property measuring devices, leading to decreased throughput and increased operator burden due to the need to stop operations for measurement, which is time-consuming and cumbersome.
Innovation Solution
A polishing apparatus with a surface-property measuring device that includes a support arm and a moving unit, allowing for automatic movement between a retreat position and a measure position, enabling continuous operation and reducing the need for manual intervention.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If manual attachment and detachment of surface-property measuring device is performed, then measurement function is provided, but throughput decreases and operator burden increases
Solution Approach 1:
The surface-property measuring device is mounted on a movable support arm that can automatically move between a measurement position and a retreated position. The support arm is coupled to a moving unit (piston-cylinder mechanism) that enables dynamic repositioning without manual intervention, allowing the measuring device to be automatically positioned for measurement and retracted to avoid interference during polishing operations.
Solution Approach 2:
The measuring device is designed to automatically move to the measurement position through the moving unit when measurement is required, eliminating the need for manual attachment and detachment operations. The system performs the positioning action itself through automated control, reducing operator burden and maintaining continuous polishing operations.
2Measurement precision
If surface-property measuring device is attached for measurement, then surface properties can be measured, but polishing operation must be stopped causing time loss
Solution Approach 1:
The support arm with the measuring device can dynamically move between positions - advancing to the measurement position when measurement is needed and retreating to allow continuous polishing. This dynamic repositioning enables the system to perform measurements without permanently stopping the polishing operation, reducing time loss.
Solution Approach 2:
The measuring device operates periodically by moving to the measurement position, performing measurement, then retreating to allow polishing to continue. This periodic action pattern allows intermittent measurements without continuous interruption of the polishing process, minimizing time loss while maintaining measurement capability.
3Ease of operation
If surface-property measuring device is manually handled, then measurement function is achieved, but operator burden increases
Solution Approach 1:
The measuring device is designed to automatically move to the measurement position through the moving unit when measurement is required, eliminating the need for manual attachment and detachment operations. The system performs the positioning action itself through automated control, reducing operator burden and maintaining continuous polishing operations.
Solution Approach 2:
The movable support arm acts as an intermediary mechanism between the measuring device and the polishing apparatus frame. It provides a mechanical coupling that enables automatic positioning and movement, mediating the interaction between the measuring device and the rest of the system to eliminate manual handling requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The automatic measurement of surface properties increases the throughput of the polishing apparatus, reduces operator burden, and ensures consistent CMP performance by allowing continuous operation without stopping the polishing process.
Implementation Method 1
a surface-property measuring device configured to measure surface properties of a polishing pad by applying a laser beam to the polishing pad and receiving light reflected by the polishing pad
Data Source
AI summary
The present invention relates to a polishing apparatus having a surface-property measuring device for measuring surface properties of a polishing pad which is used to polish a substrate, such as semiconductor wafer, and a polishing system including such a polishing apparatus. The polishing apparatus includes a surface-property measuring device (30) for measuring surface properties of a polishing pad (2), a support arm (50) for supporting the surface-property measuring device (30), and a moving unit (53) coupled to the support arm (50) and configured to move the surface-property measuring device (30) from a retreat position to a measure position.