Polishing Pad with 2D Sheet Material for Thermal Conductivity
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Solution Overview
Problem
The chemical mechanical polishing process in semiconductor device fabrication faces challenges in achieving uniformity and productivity due to temperature-related changes in polishing properties, which existing technologies struggle to efficiently control.
Innovation Solution
A polishing pad with a polymer matrix and a temperature-sensitive agent, such as 2D sheet materials like graphene or hexagonal boron nitride, is used to enhance thermal conductivity, allowing for better temperature control and improved polishing efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional polishing pads are used, then the polishing process can be performed, but temperature control is poor leading to non-uniform polishing properties
Solution Approach 1:
The polishing pad uses a composite structure combining a polymer matrix with thermally conductive particles (metal, ceramic, or carbon-based particles) dispersed throughout. This composite material enables efficient heat conduction from the polishing surface to the platen, improving temperature control and polishing uniformity while maintaining the cushioning and polishing functions of the polymer matrix.
2Device complexity
If polishing is performed without temperature control, then the process is simple, but polishing properties change due to temperature variations
Solution Approach 1:
The polishing pad structure itself provides temperature control functionality through its thermally conductive composite material, eliminating the need for additional active cooling or heating systems. The pad passively conducts heat from the polishing interface to the platen, achieving temperature control as an inherent function of the material design rather than requiring separate control systems.
3Temperature
If the polishing pad has high thermal conductivity, then temperature control improves, but the cushioning effect may be reduced
Solution Approach 1:
The polishing pad employs a gradient structure where the polymer matrix content and particle distribution vary through the thickness of the pad. The region closer to the polishing surface has higher particle concentration for thermal conduction, while regions deeper in the pad have more polymer matrix for cushioning. This local variation in composition allows simultaneous optimization of both thermal conductivity and cushioning properties.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The polishing pad with enhanced thermal conductivity enables faster heating or cooling to required temperatures, thereby improving the uniformity and productivity of the chemical mechanical polishing process.
Implementation Method 1
a temperature sensitive agent dispersed in the polymer matrix and constituting 1 to 40% by volume of the polishing pad, wherein the temperature sensitive agent includes a two-dimensional (2D) sheet material having a thermal conductivity of 1 W/(m·K) or more
Data Source
AI summary
A polishing pad for chemical mechanical polishing includes a polymer matrix and a temperature sensitive agent dispersed in the polymer matrix and constituting 1 to 40% by volume of the polishing pad, wherein the temperature sensitive agent includes a two-dimensional (2D) sheet material having a thermal conductivity of 1 W/(m·K) or more.