Polishing Pad Contact Member Baffle Heat Insulation
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Solution Overview
Problem
Existing polishing apparatuses for semiconductor substrates face inefficiencies in controlling the surface temperature of polishing pads, leading to wasted heat and uneven polishing rates due to heat loss between adjacent liquid flow paths and poor heat transfer efficiency.
Innovation Solution
A polishing apparatus with a pad contact member featuring a liquid flow path and planar baffles that suppress heat movement between adjacent flow paths by creating a heat insulation layer, either with air or vacuum within the baffle space, and using a temperature-controlled liquid supply system to optimize the surface temperature of the polishing pad.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a planar pad contact member with liquid flow path is used to control polishing pad temperature, then heat transfer to the polishing pad is improved, but heat is wasted between adjacent liquid flow paths
Solution Approach 1:
The liquid flow path is segmented into multiple independent channels separated by partition walls. Each channel can independently control temperature without heat interference from adjacent channels, eliminating heat waste while maintaining effective heat transfer to the polishing pad surface.
Solution Approach 2:
Partition walls act as intermediary structures between adjacent liquid flow paths. These walls prevent direct heat transfer between neighboring channels while allowing each channel to efficiently transfer heat to the polishing pad through dedicated contact areas.
2Manufacturing precision
If temperature-controlled liquid is supplied to the pad contact member, then polishing rate uniformity is improved, but heat transfer efficiency is reduced due to heat loss
Solution Approach 1:
Dividing the flow path into segmented channels ensures that temperature-controlled liquid in each channel maintains its thermal characteristics without loss to adjacent channels. This segmentation preserves heat transfer efficiency while achieving uniform polishing across the pad surface.
Solution Approach 2:
Each segmented channel is optimized for local heat transfer quality, with partition walls preventing heat loss to neighboring channels. This local optimization ensures efficient heat transfer in each zone while contributing to overall polishing uniformity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively transfers heat from the liquid flow path to the polishing pad without waste, maintaining an optimal surface temperature for improved polishing rates and uniformity.
Implementation Method 1
the baffle has a space therein... suppress heat movement between adjacent flow paths by creating a heat insulation layer
Implementation Method 2
transfer heat from the temperature-controlled liquid flowing in the liquid flow path to the surface of the polishing pad
Data Source
AI summary
Disclosed is a polishing apparatus that polishes a substrate by causing the substrate to be in slide contact with a polishing pad. The polishing apparatus includes a pad temperature control mechanism configured to control a surface temperature of the polishing pad, which includes a pad contact member that comes in contact with the surface of the polishing pad and a liquid supply system configured to supply a temperature-controlled liquid to the pad contact member. The pad contact member includes a liquid flow path therein, and the liquid flow path communicates with a liquid inlet and a liquid outlet connected to the liquid supply system. At least one planar baffle is disposed in the liquid flow path, and the baffle has a space therein.