Polishing Pad Embedded Sections Grooves Slurry Distribution
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Solution Overview
Problem
Current polishing processes require multiple polishing pads with different material properties, increasing complexity and reducing production efficiency due to the need for specific properties in various polishing operations.
Innovation Solution
A polishing pad with a novel structure featuring a carrier layer and embedded sections, where the embedded sections are embedded in the carrier layer and alternately arranged with grooves, allowing for combined material properties such as varying porosity and water permeability to enhance polishing efficiency and lifespan.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple polishing pads with different material properties are used to meet different polishing requirements, then the polishing performance is improved, but the production complexity and management complexity increase
Solution Approach 1:
The patent combines multiple polishing properties into a single polishing pad by integrating a carrier layer with multiple embedded sections having different material properties. This merging approach allows the pad to provide various polishing functions simultaneously, eliminating the need for multiple separate pads and reducing production and management complexity.
Solution Approach 2:
The polishing pad is designed with multi-functionality by incorporating different embedded sections that provide various polishing properties within a single device. This universal design enables the pad to handle different polishing requirements across various production stages, making it adaptable to diverse applications while simplifying inventory and management.
2Adaptability or versatility
If multiple polishing pads with different material properties are used, then the polishing performance is improved, but the production efficiency decreases
Solution Approach 1:
By merging multiple polishing functions into one integrated pad structure with different embedded sections, the system reduces the number of pad changes and selections required during production, thereby improving overall production efficiency while maintaining versatile polishing performance.
3Ease of manufacture
If a single polishing pad material is used, then the production complexity is reduced, but the polishing rate and lifespan are limited
Solution Approach 1:
The patent employs composite material structure by combining a carrier layer with multiple embedded sections of different materials. This composite approach enables the polishing pad to achieve superior polishing rates and extended lifespan through optimized material properties in different regions, while the overall structure remains manufacturable through integrated production processes.
4Ease of manufacture
If a single polishing pad material is used, then the production simplicity is maintained, but the slurry distribution and delamination resistance are insufficient
Solution Approach 1:
The composite structure with carrier layer and embedded sections provides improved slurry distribution channels and enhanced delamination resistance through the interfacial design and material properties of the composite layers, while maintaining production simplicity through integrated manufacturing methods.
Data Source
AI summary
A polishing layer of a polishing pad is provided. The polishing layer of the polishing pad includes a carrier layer and a plurality of embedded sections. The embedded sections embedded in the carrier layer are located in a polishing surface of the polishing layer, wherein in the polishing surface of the polishing layer, a groove is included in the carrier layer between every two adjacent embedded sections.