Polishing Pad with Endothermic Reactant for Temperature Control
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Solution Overview
Problem
Current polishing processes face challenges in controlling temperature distribution during polishing, leading to uneven temperature gradients and increased costs due to complex equipment modifications or limitations in reactant and slurry combinations.
Innovation Solution
A polishing pad with distinct regions containing endothermic and exothermic reactants, allowing for controlled temperature adjustments by reacting with water in the slurry, reducing temperature gradients and enhancing applicability without requiring equipment modifications or limiting slurry combinations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If equipment modifications are added to control temperature during polishing, then temperature control capability is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The polishing pad contains reactants that automatically undergo endothermic or exothermic reactions with water in the slurry based on the local temperature conditions during polishing. The system self-regulates temperature without requiring external control equipment, modifications, or additional energy input, thus improving temperature control capability while avoiding increased device complexity
Solution Approach 2:
The invention changes the chemical composition parameter of the polishing pad by incorporating specific reactants (such as urea, ammonium nitrate for endothermic reactions; calcium oxide, sodium hydroxide for exothermic reactions). These chemical parameter changes enable the pad to actively regulate temperature through chemical reactions with water in the slurry, achieving temperature control without mechanical or electronic equipment modifications
2Temperature
If reactants are added to the polishing pad to control temperature, then temperature control capability is improved, but applicability is limited due to inertness requirements
Solution Approach 1:
The invention converts the typically harmful friction heat generated during polishing into a beneficial control mechanism. By incorporating reactants that respond to temperature changes through endothermic or exothermic reactions with water in the slurry, the system uses the heat itself as a signal and medium for control, eliminating the need for inertness constraints and expanding slurry compatibility
Solution Approach 2:
The polishing pad is designed with multi-functionality by incorporating reactants that can work with various water-containing slurries. The reactants serve dual purposes: maintaining structural integrity of the polishing pad and actively regulating temperature through chemical reactions. This universal approach allows the same pad design to be used with different slurry compositions without requiring inertness, thus improving adaptability and versatility
3Manufacturing precision
If uniform temperature distribution is achieved during polishing, then polishing precision is improved, but temperature gradients increase leading to reduced quality
Solution Approach 1:
The invention applies local quality by distributing different reactants (endothermic and exothermic) at specific locations within the polishing pad structure. This spatial distribution allows different regions of the pad to perform different thermal functions, creating localized temperature adjustments that collectively achieve uniform overall temperature distribution across the polishing surface, thereby improving polishing precision while controlling temperature gradients
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The polishing pad achieves a more uniform temperature distribution, reducing temperature gradients and improving industrial applicability by allowing for flexible reactant placement and reaction with the slurry, thus optimizing the polishing process.
Implementation Method 1
the first reactant reacts endothermically with the water in the slurry
Implementation Method 2
the second reactant reacts exothermically with the water in the slurry
Implementation Method 3
the heat generated by friction during the polishing process changes the temperature of the polishing pad
Data Source
AI summary
A polishing pad is provided. The polishing pad, suitable for a polishing procedure using a slurry containing water, includes a polishing track region and a first reactant. The polishing track region includes a central region and a peripheral region surrounding the central region. The first reactant is disposed in the central region of the polishing track region, wherein the first reactant is able to react endothermically with the water in the slurry.