Polishing Machines TRIZ Cases

Tilting the rotary shaft breaks uniform contact patterns, resolving artificial appearance issues in mass-produced lumber.

A method uses abrasive paste and a sponge to polish mirror-finish stainless steel workpieces.

Annular grooves suspend the wafer edge to lower the local polishing rate, resolving uneven thickness caused by liquid accumulation.

Rotating removal members detach abrasive elements from backing pads, preventing buckling of soft materials during automated replacement.

A clamp with a slanted push block and guiding member automatically positions workpieces.

A polishing brush adjusts abrasive protrusion via a displacement mechanism to maintain consistent cutting load.

Hardened circular support plates suppress flower opening and extend usable diameter by wearing uniformly with the polishing portion.

Support elements prevent material sinking in deep grooves during roughening, ensuring uniform adhesion for retreaded tires.

A polishing pad integrates a covalently bonded detection region to monitor metal layer thickness via magnetic flux changes.

A wafer polishing carrier lift unit adjusts position to optimize contact points between the carrier and surface plates.

Opposing rotatable brushes engage panel surfaces to remove coatings while liquid contact manages debris and reduces safety risks.

Rotary brushes remove pipe coatings via friction, preserving wall strength by avoiding cutting grooves.

A Laval nozzle jets supercooled droplets onto a rotating polishing pad to achieve rapid thermal reduction during chemical mechanical planarization.

A substrate polishing apparatus adjusts rotation and brush speeds to ensure uniform material removal across the wafer surface.

Shot peening applies compressive residual stresses to gear tooth flanks, preventing pitting failures without increasing gear diameter.

Vibratory burnishing and nitric acid leaching remove surface contaminants from gold evaporative sources, preventing spitting during thin-film deposition.

A CMP machine uses an electrostatic dissipative pedestal to remove accumulated wafer charge, preventing physical damage from sudden discharge.

A polishing pad incorporates an endothermic reactant in its central region to absorb heat from slurry water during the polishing process.

A transparent polishing pad uses liquid-filled polymeric capsules to enable in-situ optical end-point detection.

A detection coil wound in a single row and plural layers enhances sensor sensitivity for semiconductor wafer monitoring.

Closed-loop pressure control in CMP carrier zones adjusts local force to maintain uniform material removal across the wafer surface.

A composite polishing paste reduces surface roughness Ra values on bearing steel through optimized abrasive and lubricant interactions.

A flexible membrane assembly in a wafer carrier controls backpressure to eliminate edge effects and improve planarization uniformity.

Dimensionally stable ring elements with integrated helical dividing walls simplify assembly of heat exchanger casings.

Inclined support wall with protrusion presses rectangular optical fiber ferrules to prevent bending from recess variations.