Polishing Pad Groove Segmentation for Slurry Flow Control
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Solution Overview
Problem
Conventional polishing pads exhibit non-uniform slurry flow distribution, leading to inconsistent removal rates during chemical mechanical polishing processes, particularly affecting the center region of objects being polished.
Innovation Solution
The polishing pad features a central region, a peripheral region, and a main polishing region with annular grooves, radial extending grooves, and a grid-shaped peripheral groove, ensuring a controlled slurry flow distribution by connecting radial extending grooves with annular grooves, which facilitates uniform removal rates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If concentric grooves are formed on the polishing pad surface, then slurry accommodation is improved, but slurry flow distribution to the center region deteriorates
Solution Approach 1:
The polishing pad surface is segmented into multiple functional zones with different groove patterns: concentric grooves in the peripheral region for slurry accumulation, radial grooves in the main polishing region for directional transport, and grid-shaped grooves in the center region for distributed flow. This segmentation allows each region to perform its specific function optimally, resolving the contradiction between slurry accommodation and uniform flow distribution.
Solution Approach 2:
Different groove patterns are applied to different regions of the polishing pad according to their specific functional requirements. The peripheral region uses concentric grooves for slurry storage, the main polishing region uses radial grooves for efficient transport, and the center region uses grid-shaped grooves for uniform distribution. This local quality approach ensures that each area has the appropriate structure for its purpose, achieving both good slurry accommodation and uniform removal rate.
2Productivity
If grid-shaped grooves are added to improve slurry transportation, then slurry flow efficiency is improved, but excessive slurry flow to the center region occurs
Solution Approach 1:
The groove system is segmented into three distinct patterns placed in specific regions: concentric grooves in the peripheral region for slurry storage, radial grooves in the main polishing region for controlled transport, and grid-shaped grooves only in the center region for flow distribution. This spatial segmentation prevents excessive slurry flow to the center while maintaining transportation efficiency.
Solution Approach 2:
The groove patterns are arranged in different spatial dimensions and orientations: concentric circles in the peripheral region, radial lines extending from the center in the main region, and a grid pattern in the center region. This multi-dimensional arrangement optimizes slurry flow paths for each region's specific needs, achieving efficient transportation without excessive center region flow.
3Manufacturing precision
If radial extending grooves are connected with annular grooves, then slurry flow distribution is improved, but device complexity increases
Solution Approach 1:
The groove structure is segmented into three simple, geometrically distinct patterns (concentric circles, radial lines, and grid shapes) that can be independently manufactured and assembled. Each pattern serves a specific function and can be created using standard machining techniques, reducing overall complexity while achieving uniform slurry flow distribution.
Solution Approach 2:
Complex groove connections are only implemented where needed - radial grooves connect to annular grooves in the main polishing region where flow distribution is critical, while the peripheral and center regions use simpler independent patterns. This localized complexity approach achieves the required flow uniformity without unnecessarily increasing device complexity throughout the entire pad.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration achieves a relatively uniform removal rate across the polished surface by optimizing slurry flow, improving the efficiency of the polishing process and addressing the issue of non-uniformity present in conventional pads.
Implementation Method 1
Through the mechanical friction generated by the relative movement and the chemical reaction of the slurry, a part of the surface of the object is removed
Implementation Method 2
Through the mechanical friction generated by the relative movement and the chemical reaction of the slurry, a part of the surface of the object is removed
Data Source
AI summary
A polishing pad is provided. The polishing pad includes a polishing layer, which includes a central region, a peripheral region, and a main polishing region located between the central region and the peripheral region. At least one annular groove is located in the main polishing region of the polishing layer. A peripheral groove is located in the peripheral region, and the peripheral groove includes grid-shaped grooves. At least one radial extending groove is located in the main polishing region of the polishing layer, and the at least one radial extending groove is connected with the at least one annular groove. A polishing system including the polishing pad and a polishing method using the polishing pad are provided.