Polishing Pad Temperature Control via DIW Guide Vane
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Solution Overview
Problem
The chemical mechanical polishing (CMP) process for substrates faces challenges in efficiently controlling the temperature of the polishing pad and preventing dilution of slurry by Deionized water (DIW), which affects the polishing efficiency and removal rate.
Innovation Solution
A substrate polishing apparatus with a temperature control assembly that includes a DIW spraying module and a guide vane to efficiently discharge DIW and slurry to the outside of the polishing pad, while maintaining temperature control through a housing accommodating both modules, and adjustable components to optimize the flow and angle of the guide vane.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a large amount of DIW is sprayed onto the polishing pad for temperature control, then the temperature control effectiveness is improved, but the slurry is diluted which reduces polishing efficiency
Solution Approach 1:
The polishing pad surface is divided into two distinct zones: a first region where slurry is applied for polishing, and a second region where DIW is sprayed for temperature control. This spatial segmentation allows both functions to operate simultaneously without interfering with each other, preventing slurry dilution while maintaining effective temperature control.
Solution Approach 2:
Different regions of the polishing pad are assigned different functional properties: the first region maintains slurry concentration for polishing efficiency, while the second region receives DIW for thermal management. This local differentiation of fluid application ensures that temperature control does not compromise polishing performance.
2Temperature
If DIW is sprayed onto the polishing pad for temperature control, then the temperature control is improved, but slurry and particles are not effectively discharged which affects polishing quality
Solution Approach 1:
A guide vane is positioned to extract and direct the flow of DIW, slurry, and particles away from the polishing region. The guide vane channels this mixed fluid toward a discharge port, effectively removing contaminants from the polishing zone and preventing them from degrading polishing quality, while maintaining temperature control functionality.
3Productivity
If the amount of DIW discharged from the polishing pad is controlled, then slurry dilution is reduced, but temperature control effectiveness may be compromised
Solution Approach 1:
The system employs adjustable components including a height adjustment unit that can raise or lower the guide vane, and an angle adjustment unit that can tilt the guide vane. These dynamic adjustments allow optimization of DIW discharge characteristics to balance temperature control effectiveness with prevention of slurry dilution, adapting to different operating conditions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively prevents slurry dilution and enhances temperature control, improving the polishing efficiency and removal rate by efficiently managing the discharge of DIW and slurry, thereby maintaining optimal polishing conditions.
Implementation Method 1
a guide vane configured to guide at least a portion of the DIW sprayed from the DIW spraying module to an outside of the polishing pad
Implementation Method 2
a temperature control assembly configured to control a temperature of the polishing pad... a DIW spraying module configured to spray DIW toward the polishing pad
Implementation Method 3
a polishing pad configured to polish a surface to be polished of the substrate gripped by the carrier while rotating
Data Source
AI summary
Provided is a substrate polishing apparatus. The substrate polishing apparatus includes a carrier configured to grip a substrate, a polishing pad configured to polish a surface to be polished of the substrate gripped by the carrier while rotating, and a temperature control assembly configured to control a temperature of the polishing pad, and the temperature control assembly includes Deionized water (DIW) spraying module configured to spray DIW toward the polishing pad and a guide vane configured to guide at least a portion of the DIW sprayed from the DIW spraying module to an outside of the polishing pad.