Polishing Pad Interconnected Pores Slurry Flow
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Solution Overview
Problem
Conventional polishing pads exhibit high resistance to slurry flow, leading to undesirable debris loading and reduced CMP removal rates with higher substrate defectivity during chemical mechanical polishing processes.
Innovation Solution
Polishing pads with interconnected pores are developed, utilizing additive manufacturing to enhance slurry transport efficiency, reducing debris loading and improving CMP removal rates and substrate quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional polishing pads with isolated pores are used, then structural stability is maintained, but slurry flow resistance increases leading to debris loading and reduced CMP removal rates
Solution Approach 1:
The polishing pad employs a porous elastomeric material with interconnected pores that allow slurry to penetrate and flow through the pad structure. This porous structure reduces slurry flow resistance and prevents debris loading while maintaining structural stability during CMP operations.
Solution Approach 2:
The interconnected pore network enables continuous slurry flow through the polishing pad, ensuring constant renewal of polishing slurry at the contact surface. This continuous flow action prevents debris accumulation and maintains consistent CMP removal rates throughout the polishing process.
2Ease of operation
If conventional polishing pads are used, then manufacturing simplicity is maintained, but debris loading increases due to limited slurry transport
Solution Approach 1:
The use of porous elastomeric material with interconnected pore structure enables efficient slurry transport through the pad. This porous design allows slurry to penetrate deep into the pad and flow through interconnected channels, preventing debris loading while maintaining ease of operation.
Solution Approach 2:
The polishing pad utilizes hydraulic flow of slurry through its porous structure to transport polishing fluid efficiently. The interconnected pores create fluid pathways that facilitate slurry penetration and flow, reducing debris loading through hydraulic action.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The use of interconnected pores in polishing pads results in faster and more uniform slurry renewal, enhancing CMP removal rates and reducing substrate defectivity compared to conventional pads with isolated pores.
Implementation Method 1
The method includes exposing the manufacturing support with the dispensed droplets to a UV light source to at least partially cure the pre-polymer composition, thereby forming a print layer
Data Source
AI summary
Embodiments herein generally relate to polishing pads and methods of forming polishing pads. A polishing pad includes a plurality of polishing elements and a plurality of grooves disposed between the polishing elements. Each polishing element includes a plurality of individual posts. Each post includes an individual surface that forms a portion of a polishing surface of the polishing pad and one or more sidewalls extending downwardly from the individual surface. The sidewalls of the plurality of individual posts define a plurality of pores disposed between the posts.