Polishing Pad Adhesion-Reducing Interface Layer
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Solution Overview
Problem
Concentrated stress during the polishing process in device manufacturing leads to protrusion or deformation of polishing pads, potentially damaging the pad or the object being polished, and existing solutions with recessed surfaces can introduce bubbles, affecting stability.
Innovation Solution
A polishing pad with an adhesion-reducing interface layer between the polishing layer and the adhesive layer, or between the adhesive layers and the platen, which reduces adhesion in stress-concentrated regions to alleviate stress and prevent deformation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If adhesive layers are provided at interfaces between polishing pad layers or between polishing pad and platen for tight adhesion, then adhesion strength is improved, but concentrated stress causes protrusion or deformation during polishing
Solution Approach 1:
The patent applies local quality by providing adhesive layers only at specific peripheral regions rather than across the entire interface. The adhesive layers are positioned at the radial edges and circumferential edges of the polishing layer, creating localized adhesion zones that secure the polishing pad to the platen without generating concentrated stress across the entire contact surface. This selective adhesion approach maintains structural integrity while preventing deformation.
2Stress or pressure
If recesses are provided on back surface of polishing layer or adhesive layer to alleviate concentrated stress, then stress concentration is reduced, but bubbles are generated at interfaces during adhesion
Solution Approach 1:
The patent extracts the adhesive function from the entire interface and relocates it to specific peripheral regions. By removing adhesive layers from the central stress-concentrated areas and retaining them only at the edges, the solution alleviates stress concentration while maintaining sufficient adhesion. This extraction approach prevents bubble formation in the adhesive-free central region while preserving structural stability through edge adhesion.
3Strength
If adhesive layers cover entire interface for maximum adhesion, then adhesion strength is improved, but stress concentration increases during polishing
Solution Approach 1:
The patent segments the adhesive layer into multiple discrete regions positioned at specific locations (radial edges and circumferential edges) rather than providing a continuous adhesive layer across the entire interface. This segmentation distributes the adhesion function across multiple localized zones, reducing stress concentration while maintaining overall adhesion strength through the combined effect of multiple adhesive regions.
Data Source
AI summary
A polishing pad is provided. The polishing pad, disposed on a polishing platen and suitable for a polishing process, includes a polishing layer, an adhesive layer and at least one adhesion-reducing interface layer. The adhesive layer is disposed between the polishing layer and the polishing platen. The at least one adhesion-reducing interface layer is disposed between the adhesive layer and the polishing layer and/or disposed between the adhesive layer and the polishing platen. An area of the at least one adhesion-reducing interface layer is smaller than an area of the adhesive layer.