Chemical Mechanical Polishing Pad Resistivity and Scratch Control
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Solution Overview
Problem
Current chemical mechanical polishing pads face challenges in achieving high removal rates while maintaining surface quality, as they often suffer from scratches and inadequate in-plane uniformity, which are exacerbated by difficulties in controlling foaming and pore formation.
Innovation Solution
A chemical mechanical polishing pad with a polishing layer surface resistivity of 1.0×10^7 to 9.9×10^13 Ω, composed of a polymer matrix and an additive with specific volume resistivity ranges, incorporating water-soluble particles and a crosslinking agent to enhance mechanical strength and uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If polyurethane foam is used as a chemical mechanical polishing pad, then the pad can hold aqueous dispersion in pores, but the foaming is difficult to control resulting in quality variation and scratch production
Solution Approach 1:
The patent changes the fundamental parameter of the polishing pad material from polyurethane foam to a water-insoluble matrix resin system. This parameter change eliminates the foaming control issue entirely while maintaining the pore structure necessary for holding aqueous dispersion, thereby resolving the contradiction between quality consistency and ease of manufacture
Solution Approach 2:
The patent uses a composite material system consisting of water-insoluble matrix resin combined with water-soluble particles. This composite approach allows the water-soluble particles to dissolve and create pores during polishing, while the water-insoluble matrix provides structural stability and consistent quality, eliminating both foaming control issues and scratch production
2Manufacturing precision
If water-soluble particles are dissolved in water-insoluble matrix resin to form pores, then pore size and distribution can be controlled, but in-plane uniformity in polishing amount becomes unsatisfactory
Solution Approach 1:
The patent applies local quality by incorporating water-soluble particles distributed throughout the water-insoluble matrix resin. These particles dissolve locally during polishing to create pores where needed, enabling both precise pore control and uniform polishing across the entire pad surface by ensuring consistent local pore formation throughout the material
3Productivity
If conventional polishing pads are used to achieve high removal rate, then polishing speed increases, but scratch production on polished surface increases
Solution Approach 1:
The patent utilizes a porous material structure created by dissolving water-soluble particles in the water-insoluble matrix. This porous structure allows aqueous dispersion to be held and released uniformly during polishing, enabling high removal rates through efficient material removal while the controlled pore distribution prevents scratch formation by ensuring uniform polishing pressure and slurry distribution
Data Source
AI summary
The present invention relates to polishing pads, including at least 60 to 99 parts by weight of a polymer matrix (A) having 1,2-polybutadiene; and 1 to 40 parts by weight of component (B) having a copolymer having a polyether block, where the total amount of the polishing pad is 100 parts by mass, polymer matrix (A) includes 1,2-polybutadiene in an amount of at least 60 parts by weight, relative to 100 parts by mass of the polishing pad, component (B) includes the copolymer having a polyether block in an amount of at most 40 parts by weight relative to 100 parts by mass of the polishing pad, and the polishing pads have a surface resistivity of 2.6×107 to 9.9×1013Ω.