Polishing Pad Spherical Cell Structure for Durability
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Solution Overview
Problem
Conventional polishing pads for finishing surfaces, such as semiconductor wafers and glass substrates, suffer from poor durability and stability due to their thin and long cell structure or weak mechanical strength, leading to inferior planarizing characteristics and removal rate consistency.
Innovation Solution
A polishing pad with a thermosetting polyurethane foam polishing layer featuring roughly spherical interconnected cells with an average diameter of 35 to 300 μm, which enhances durability and stability by preventing deformation and maintaining high planarizing characteristics over time.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional polishing pads with thin and long cell structure are used, then the polishing pad can be produced with standard manufacturing processes, but the durability and mechanical strength are poor
Solution Approach 1:
The patent applies spheroidality by transforming the conventional thin and long cell structure into a roughly spherical cell structure with diameter of 35-300 μm. This spherical geometry provides more uniform stress distribution and prevents cell collapse under polishing pressure, thereby improving both durability and mechanical strength simultaneously.
Solution Approach 2:
The patent changes the cell diameter parameter to 35-300 μm and uses thermosetting polyurethane foam material, which fundamentally alters the mechanical properties of the polishing pad. This parameter change enables the pad to maintain high durability and mechanical strength during extended use.
2Manufacturing precision
If conventional polishing pads are used, then the initial polishing performance can be achieved, but the planarizing characteristics deteriorate gradually over time
Solution Approach 1:
The spherical cell structure maintains its geometric integrity under repeated polishing pressure, preventing the gradual deformation that occurs with conventional elongated cells. This geometric stability ensures consistent planarizing characteristics throughout the service life of the polishing pad.
Solution Approach 2:
By optimizing the cell diameter to 35-300 μm and using thermosetting polyurethane foam, the patent creates a polishing pad that maintains stable dimensional and mechanical properties over time, preventing deterioration of planarizing characteristics during extended use.
3Productivity
If conventional polishing pads are used, then the initial removal rate can be achieved, but the removal rate stability is inferior
Solution Approach 1:
The patent optimizes the cell diameter parameter to 35-300 μm and uses thermosetting polyurethane foam material, which provides stable mechanical properties during polishing. This stability ensures consistent removal rate throughout the service life, preventing the deterioration seen in conventional pads.
Data Source
AI summary
A polishing pad of excellent durability has a polishing layer is arranged on a base material layer, and the polishing layer comprises a thermosetting polyurethane foam having roughly spherical interconnected cells with an average cell diameter of 35 to 300 μm.