Polishing Pad Surface Property Control via Pre-Measurement Cleaning

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Solution Overview

Problem

Existing polishing methods face challenges in accurately detecting the surface properties of polishing pads due to interference from polishing dusts and liquids, leading to suboptimal dressing and reduced polishing efficiency.

Innovation Solution

A method that involves obtaining correlation data between surface properties of polishing pads under different dressing conditions and polishing effects, determining optimal dressing conditions, and regularly measuring and adjusting the surface properties to maintain predetermined levels, ensuring accurate dressing and polishing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If the surface property of the polishing pad is measured while polishing the work, then the dressing can be controlled in response to the surface property changes, but the measurement accuracy deteriorates due to polishing dusts and polishing liquid causing cloudy images

Engineering Contradiction:
Improvesurface property measurement accuracyVSAvoidinterference from polishing dusts and liquid
Core Design Contradiction:
Measurement precisionVSObject-affected harmful factors

Solution Approach 1:

The polishing pad is cleaned before measuring its surface properties. This preliminary cleaning action removes polishing dusts and polishing liquid that would interfere with the measurement, thereby enabling accurate measurement without compromising the subsequent polishing process.

Inventive Principle:
Principle #10Preliminary action

2Measurement precision

If the polishing pad is cleaned before measuring surface properties, then measurement accuracy improves, but the process time increases

Engineering Contradiction:
Improvesurface property measurement accuracyVSAvoidprocess time
Core Design Contradiction:
Measurement precisionVSLoss of time

Solution Approach 1:

The system measures the surface properties of the polishing pad after cleaning and uses this feedback information to determine whether dressing is needed and when. This feedback mechanism optimizes the timing of dressing operations, preventing unnecessary dressing cycles and reducing overall process time while maintaining measurement accuracy.

Inventive Principle:
Principle #23Feedback

Data Source

PatentUS10464186B2Method of polishing work and method of dressing polishing pad
Publication Date: 2019.11.05 FUJIKOSHI MACHINERY
  • US10464186B2 patent drawing
  • US10464186B2 patent drawing
  • US10464186B2 patent drawing

AI summary

The method of the present invention comprises the steps of: previously obtaining correlation data between surface properties of the polishing pad dressed under a plurality of stages of dressing conditions and polishing effects of the work polished by the polishing pad dressed under the dressing conditions; determining an assumed dressing condition capable of achieving an object polishing effect from the correlation data; dressing the polishing pad under the assumed dressing condition determined; polishing the work; cleaning the polishing pad which has been used for polishing the work; and measuring a surface property of the cleaned polishing pad.