Polishing Pad Temperature Control via Contact Regulator
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Solution Overview
Problem
Chemical mechanical polishing (CMP) processes face challenges in achieving uniform substrate polishing due to temperature variations in the polishing surface, which affect polishing rate and surface hardness, leading to non-uniform results.
Innovation Solution
A substrate polishing apparatus that includes a temperature controller using PID control to regulate the polishing pad's surface temperature by detecting and adjusting it with a pad-temperature detector and regulator, ensuring consistent temperature across the polishing surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If contact pressure of the substrate surface against the polishing surface is regulated to optimize pressure distribution, then polishing uniformity is improved, but polishing rate varies due to temperature distribution in the polishing surface
Solution Approach 1:
The invention changes the temperature parameter of the polishing surface by introducing a temperature regulator that contacts the polishing surface. This regulator actively controls the temperature to maintain uniformity across the polishing surface, thereby preventing the temperature-induced variations in polishing rate while preserving the benefits of optimized contact pressure distribution.
2Device complexity
If temperature of the polishing surface is not controlled, then device complexity is reduced, but polishing rate varies from portion to portion due to temperature distribution
Solution Approach 1:
The invention introduces a temperature regulator as an intermediary component that contacts the polishing surface. This regulator acts as a mediator between the heat sources (substrate and retainer ring) and the polishing surface, actively managing heat transfer to maintain uniform temperature distribution, thereby achieving polishing uniformity without excessive system complexity.
3Manufacturing precision
If temperature of the polishing surface is regulated to maintain constant temperature, then polishing uniformity and slurry stability are improved, but device complexity increases due to heating and cooling functions
Solution Approach 1:
The temperature regulator is designed with multi-functionality, capable of both heating and cooling the polishing surface. This universal design allows a single device to handle both heating and cooling requirements, reducing the need for separate heating and cooling systems, thereby improving polishing uniformity while minimizing the increase in device complexity.
4Use of energy by moving object
If temperature distribution in the polishing surface is not controlled, then energy consumption is reduced, but slurry deteriorates and polishing uniformity decreases
Solution Approach 1:
The temperature regulator operates with feedback control, continuously monitoring the temperature of the polishing surface and adjusting its heating or cooling output accordingly. This feedback mechanism ensures that energy is consumed only when necessary to maintain the desired temperature uniformity, preventing both energy waste and slurry deterioration while preserving polishing uniformity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach optimizes and maintains a constant polishing rate, reduces slurry usage, and improves polishing uniformity and productivity by controlling the polishing pad's temperature based on substrate type and processing conditions.
Implementation Method 1
a pad-temperature regulator configured to contact the polishing surface of the polishing pad to regulate the temperature of the polishing surface
Implementation Method 2
controlling the temperature of the polishing surface via proportional integral derivative (PID) control
Data Source
AI summary
An apparatus for polishing a substrate includes a rotatable polishing table supporting a polishing pad, a substrate holder configured to hold the substrate and press the substrate against a polishing surface of the polishing pad on the rotating polishing table so as to polish the substrate, and a pad-temperature detector configured to measure a temperature of the polishing surface of the polishing pad. The apparatus also includes a pad-temperature regulator configured to contact the polishing surface to regulate the temperature of the polishing surface, and a temperature controller configured to control the temperature of the polishing surface by controlling the pad-temperature regulator based on information on the temperature of the polishing surface detected by the pad-temperature detector.