Polishing Pad Window Interface Moisture Leakage Prevention
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current polishing pads in semiconductor manufacturing face challenges with moisture leakage through the interface between the window and the pad, leading to reduced durability and suboptimal polishing performance over extended periods.
Innovation Solution
A polishing pad design featuring a multi-stage adhesive layer structure and a compressed region in the support layer, combined with a window that minimizes moisture permeability, ensures long-term durability and improved process efficiency by preventing leaks and enhancing polishing rate and flatness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a window is applied to the polishing pad for endpoint detection, then polishing quality and process control are improved, but moisture leakage through the interface between the window and polishing pad occurs, reducing durability
Solution Approach 1:
The interface between the window and polishing pad is divided into multiple adhesive layers with different properties. The first adhesive layer (moisture curable resin) provides initial bonding and moisture resistance, while the second adhesive layer (thermoplastic resin) provides additional adhesion and sealing. This segmentation of the bonding interface prevents moisture leakage while maintaining the window's endpoint detection function.
Solution Approach 2:
The invention uses composite adhesive structures combining moisture curable resin and thermoplastic resin in specific layers. This composite approach creates a multi-functional interface that simultaneously provides structural bonding, moisture resistance, and sealing properties, preventing leakage while maintaining polishing quality.
2Productivity
If the polishing pad is used for extended periods to maintain productivity, then process efficiency is improved, but moisture leakage and degradation occur, reducing reliability
Solution Approach 1:
The window and support layer are pre-assembled with multiple adhesive layers and compressed regions before being integrated into the polishing pad. This preliminary preparation of the interface structure prevents moisture leakage from occurring during extended polishing operations, enabling long-term reliable operation.
Solution Approach 2:
A compressed region is created locally at the interface between the window and support layer, concentrating the sealing function at the critical leakage point. This localized compression enhances the moisture resistance at the specific interface area without affecting the overall pad structure, enabling extended usage.
3Measurement precision
If the first through hole is made larger for better window visibility and endpoint detection, then measurement precision is improved, but moisture leakage through the interface increases
Solution Approach 1:
The sealing function is segmented into multiple adhesive layers rather than relying on a single large adhesive layer. This allows the first through hole to be sized for optimal endpoint detection while the multi-layer adhesive structure provides comprehensive moisture protection at the interface.
Solution Approach 2:
The multiple adhesive layers act as intermediary sealing elements between the window and polishing pad. These intermediary layers fill the interface gaps and prevent moisture from reaching the first through hole, allowing the hole to be sized for optimal detection without compromising sealing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents moisture leakage, maintaining pad integrity and improving polishing quality by combining a smaller second through hole with a multi-stage adhesive layer and compressed region, thereby securing excellent long-term durability and process efficiency.
Implementation Method 1
a first adhesive layer including a moisture curable resin is included between the lowermost surface of the window and the third surface
Implementation Method 2
the support layer includes a compressed region in a region corresponding to the lowermost surface of the window
Implementation Method 3
A polishing pad which is used in this CMP process is a process part for processing a polished surface to a required level through friction
Implementation Method 4
a polishing layer including a first surface which is a polished surface and a second surface which is an opposite surface thereof
Data Source
AI summary
Provided are a polishing pad provided with a structural feature capable of maximizing the leakage prevention effect, the polishing pad including: a polishing layer including a first surface which is a polished surface and a second surface which is an opposite surface thereof, and including a first through hole passing through the first surface and the second surface; a window disposed in the first through hole; and a support layer disposed at the second surface of the polishing layer.