Polishing Pad Window Void Structure for Endpoint Detection

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Solution Overview

Problem

In semiconductor device manufacturing, the chemical mechanical planarization (CMP) process faces challenges in achieving uniformity and preventing defects due to the introduction of a window for endpoint detection, which can create local heterogeneities that negatively affect polishing performance.

Innovation Solution

A polishing pad with a specific structure, including a window and a void between its side surface and the window, where the void's opening width is between 0.00 μm and 500 μm, and a volume ratio of the window to the polishing layer's through-hole is between 0.00 and 15.00, is used to minimize the impact of the window on polishing performance and enhance defect prevention.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If a window is introduced for endpoint detection in the polishing pad, then measurement precision is improved, but polishing performance deteriorates due to local heterogeneity

Engineering Contradiction:

Improveendpoint detectionVSAvoidpolishing performance

Core Design Contradiction:

Measurement precisionVSReliability

Solution Approach 1:

The polishing pad is designed with a window region that has different properties from the surrounding polishing pad material. The window has a void structure with specific volume ratios and opening widths to enable endpoint detection while minimizing negative effects on polishing performance through controlled local heterogeneity

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The window contains a void structure with controlled porosity, where the void volume ratio relative to the through-hole volume is maintained between 0.00 and 15.00, and the opening width is controlled between 0.00 μm and 500 μm. This porous structure enables light transmission for endpoint detection while maintaining polishing functionality

Inventive Principle:

Principle #31Porous materials

2Measurement precision

If a window with void structure is created for endpoint detection, then measurement precision is improved, but manufacturing precision may deteriorate due to complex structure

Engineering Contradiction:

Improveendpoint detectionVSAvoidstructure uniformity

Core Design Contradiction:

Measurement precisionVSManufacturing precision

Solution Approach 1:

The invention controls specific parameters of the void structure within defined ranges: void volume ratio between 0.00 and 15.00, and opening width between 0.00 μm and 500 μm. By maintaining parameters within these ranges, the complex void structure achieves both endpoint detection functionality and manufacturing precision

Inventive Principle:

Principle #35Parameter changes

Data Source

PatentUS20230052322A1Polishing pad and method for manufacturing semiconductor device using same

Publication Date: 2023.02.16 SK ENPULSE CO LTD

AI summary

The present disclosure is intended to provide, as a polishing pad to which a window for an endpoint detection is applied, and in which the window is capable of providing improved polishing performance in terms of preventing defects, etc., by a specific structure due to the window, rather than negatively affecting polishing performance as a local heterogeneous component on the polishing pad, a polishing pad including: a polishing layer including a first surface that is a polishing surface and a second surface that is a rear surface thereof, and containing a first through-hole penetrating from the first surface to the second surface; a window disposed in the first through-hole; and a void between a side surface of the first through-hole and a side surface of the window, and a method for manufacturing a semiconductor device by applying the same.