Double Face Polishing Apparatus Slurry Distribution
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Solution Overview
Problem
Conventional double face polishing apparatuses face challenges in controlling the amount of slurry supplied due to varying lengths of supply pipes, leading to flow resistance issues and uneven slurry distribution, which complicates the polishing process and increases production costs.
Innovation Solution
The apparatus features coaxially arranged ring-shaped ducts on the upper polishing plate, with supply pipes connecting these ducts to the lower polishing plate, allowing for shorter pipe lengths, reduced flow resistance, and precise control of slurry supply through flow control valves, ensuring uniform distribution across multiple polishing zones.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If supply pipes are made long to reach outer polishing zones, then slurry can be supplied to all zones, but flow resistance increases and slurry distribution becomes uneven
Solution Approach 1:
The polishing plate is divided into multiple concentric polishing zones, each served by its own ring-shaped duct. This segmentation allows each zone to receive slurry independently through short supply pipes, eliminating the need for long pipes that would cause high flow resistance. The segmentation principle directly resolves the contradiction by maintaining full zone coverage while minimizing pipe length and energy loss.
Solution Approach 2:
The invention transitions from a single central slurry supply point to a multi-dimensional ring-shaped duct system distributed across the polishing plate surface. This dimensional change allows slurry to be delivered to multiple zones simultaneously through short vertical pipes, reducing the horizontal distance slurry must travel and thereby minimizing flow resistance while maintaining comprehensive coverage.
2Quantity of substance
If electromagnetic valves are added to each supply pipe for precise slurry control, then slurry amount can be controlled, but device complexity and production cost increase
Solution Approach 1:
A single flow control valve installed at the main slurry supply line serves multiple polishing zones simultaneously through the ring-shaped duct distribution system. This universal control mechanism eliminates the need for individual electromagnetic valves at each supply pipe, reducing device complexity and production cost while maintaining precise slurry supply control across all zones.
Solution Approach 2:
The invention merges multiple slurry control functions into a single flow control valve located at the common supply line. By combining the control functions that would otherwise require separate electromagnetic valves for each zone, the system achieves precise slurry amount control with minimal device complexity and lower production costs.
3Loss of energy
If supply pipes are made short to reduce flow resistance, then slurry supply is smooth, but it becomes difficult to reach outer polishing zones
Solution Approach 1:
The polishing plate is divided into multiple concentric polishing zones, each served by its own ring-shaped duct positioned at the appropriate radial distance. This segmentation allows each zone to be supplied by short vertical pipes from the ring duct, enabling smooth slurry supply with minimal flow resistance while maintaining coverage of the entire polishing area through the distributed ring duct configuration.
Solution Approach 2:
The invention uses ring-shaped ducts distributed in the radial dimension to deliver slurry to different polishing zones, eliminating the need for long horizontal supply pipes. This dimensional reorganization allows short vertical pipes to serve each zone independently, achieving both low flow resistance and comprehensive area coverage simultaneously.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables easy control of slurry amount and reduces flow resistance, resulting in uniform and efficient polishing of both faces of workpieces, enhancing the mechanical and chemical polishing process while lowering production costs.
Implementation Method 1
The slurry supplied onto the lower polishing plate 10 from the slurry supply holes 22, which are located an inner part of the upper polishing plate 14, is moved toward an outer part of the lower polishing plate 10 by a centrifugal force caused by rotation of the lower polishing plate 10.
Implementation Method 2
a plurality of supply pipes communicating slurry supply holes of the ring-shaped duct means to slurry supply holes of the upper polishing plate so as to supply the slurry to the polishing face of the lower polishing plate via the slurry supply holes
Implementation Method 3
the workpieces can be mechanically and chemically polished
Implementation Method 4
the workpieces can be mechanically and chemically polished
Data Source
Figure 1
Figure 2~3
Figure 4~5
AI summary
The double face polishing apparatus (30) is capable of controlling an amount of supplying slurry to a lower polishing plate (32). The double face polishing apparatus (30) comprises: the lower polishing plate (32) and an upper polishing plate (36); a carrier (44) provided between the polishing plates (32, 36), the carrier (44) having a through-hole for holding a workpiece; a plate driving unit (40, 42) for rotating the polishing plates (32, 36); a carrier driving unit (46, 48) for rotating the carrier (44); ring-shaped ducts (54, 56) coaxially provided to the upper polishing plate (36); a slurry supply source (64) supplying slurry to the ring-shaped ducts (54, 56); and supply pipes (78) for supplying the slurry to the lower polishing plate (32). The slurry is supplied to each of coaxial polishing zones of the lower polishing plate (32) via the corresponding ring-shaped ducts (54, 56) and the supply pipes (78).