Polishing Tool Conditioning Using Non-Mirror Dummy Substrate

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Conventional polishing tools require extensive conditioning time, typically four to six hours, due to embedded dust on substrates, which reduces production efficiency and extends the time before a production wafer can be processed.

Innovation Solution

A method involving a silicon dummy substrate with a non-mirror surface, roughened using a chemical solution like ammonia water, is used for conditioning the polishing tool, allowing for faster abrasive grain protrusion removal and reducing conditioning time by using a resin body with dispersed abrasive grains.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If a polishing brush with abrasive grains is used to remove embedded dust from substrates, then the dust removal capability is improved, but the conditioning time increases to four to six hours

Engineering Contradiction:

Improveembedded dust removal capabilityVSAvoidconditioning time

Core Design Contradiction:

Object-affected harmful factorsVSLoss of time

Solution Approach 1:

The invention changes the surface state parameter of the dummy substrate from mirror state to non-mirror state. This parameter change allows the polishing brush to condition more effectively and quickly, reducing conditioning time from 4-6 hours to under 1 hour while maintaining the ability to remove embedded dust.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The invention prepares the dummy substrate in advance by creating a non-mirror surface state before the conditioning process. This preliminary action enables the polishing brush to undergo effective conditioning without requiring extended time, as the non-mirror surface is pre-configured to facilitate rapid abrasive grain protrusion removal.

Inventive Principle:

Principle #10Preliminary action

2Manufacturing precision

If conditioning is performed on the polishing brush to remove abrasive grain protrusions, then scratch occurrence is suppressed, but the device becomes unavailable for production wafer processing

Engineering Contradiction:

Improvescratch suppressionVSAvoidproduction availability

Core Design Contradiction:

Manufacturing precisionVSProductivity

Solution Approach 1:

By changing the surface state parameter of the dummy substrate to non-mirror state, the conditioning process achieves effective scratch suppression in significantly reduced time. This allows the polishing brush to be properly conditioned without extending the device unavailability period, thus maintaining production availability.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The invention enables the conditioning process to rush through quickly by using a non-mirror dummy substrate. The conditioning is completed in under 1 hour instead of 4-6 hours, allowing the device to return to production wafer processing much sooner while still achieving the necessary scratch suppression.

Inventive Principle:

Principle #21Skipping (Rushing through)

3Manufacturing precision

If a mirror-state dummy substrate is used for conditioning, then the substrate surface is smooth, but the conditioning time becomes excessively long

Engineering Contradiction:

Improvesubstrate surface smoothnessVSAvoidconditioning time

Core Design Contradiction:

Manufacturing precisionVSLoss of time

Solution Approach 1:

Instead of using a mirror-smooth dummy substrate as conventionally done, the invention inverts the approach by using a non-mirror dummy substrate. This inversion counterintuitively achieves better results: effective conditioning with under 1 hour time while still producing smooth substrate surfaces during actual polishing operations.

Inventive Principle:

Principle #13The other way round (Inversion)

Solution Approach 2:

The invention changes the surface state parameter of the dummy substrate from mirror to non-mirror. This parameter change enables the conditioning process to complete rapidly in under 1 hour while maintaining the capability to produce smooth substrate surfaces during production polishing, resolving the time-quality contradiction.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach significantly shortens the conditioning time of the polishing tool, enabling quicker transition to processing production substrates while minimizing scratches and improving production efficiency.

Implementation Method 1

a main surface of the dummy substrate is in a non-mirror state

Methodology Applied

Scientific EffectChemical etching: Erosion

Implementation Method 2

Conditioning is a process to remove excessive protrusions of abrasive grains included in the polishing brush by abutting the polishing brush against the dummy wafer that rotates

Methodology Applied

Scientific EffectAbrasion: Abrasion

Data Source

PatentUS20240253182A1Method for conditioning polishing tool, substrate processing method, and substrate processing device

Publication Date: 2024.08.01 SCREEN HOLDINGS CO LTD

AI summary

A method for conditioning a polishing tool includes: a substrate rotation process, holding a silicon dummy substrate having a main surface in a non-mirror state in a horizontal posture and rotating the dummy substrate about a vertical axis; and a conditioning execution process, executing conditioning of the polishing tool by bringing the polishing tool into contact with the main surface of the dummy substrate that is being rotated, wherein the polishing tool has a resin body in which abrasive grains are dispersed.