Polishing Units for Large Substrate Support
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Solution Overview
Problem
As display device sizes increase, the size of the substrate also grows, leading to larger upper plates in polishing processes, which become difficult to support due to increased weight, limiting the ability to polish larger substrates effectively.
Innovation Solution
A substrate polishing apparatus with a support system that includes first and second moving parts and polishing units, allowing substrates of various sizes to be polished by rotating and revolving polishing units along a predetermined trajectory, with nozzles for slurry application, enabling efficient polishing without the need for a large upper plate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the size of the upper plate is increased to polish larger substrates, then the polishing capability for larger substrates is improved, but the weight of the upper plate increases making it difficult to support
Solution Approach 1:
The upper plate is divided into multiple polishing units that can independently move and polish different regions of the substrate. Each polishing unit has its own driving mechanism, allowing the system to handle large substrates without requiring a single massive upper plate, thus reducing the weight and support requirements.
Solution Approach 2:
The polishing units are designed to move dynamically along the substrate surface rather than relying on a static large upper plate. The driving units enable the polishing units to traverse the substrate, providing the necessary polishing action across large areas while maintaining manageable weight for each individual polishing unit.
2Adaptability or versatility
If the size of the upper plate is increased to polish larger substrates, then the polishing capability for larger substrates is improved, but the device complexity increases due to support requirements
Solution Approach 1:
The upper plate is divided into multiple polishing units that can independently move and polish different regions of the substrate. Each polishing unit has its own driving mechanism, allowing the system to handle large substrates without requiring a single massive upper plate, thus reducing the weight and support requirements.
Solution Approach 2:
A support unit is introduced as an intermediary component to hold and position the polishing units. This support unit simplifies the overall structure by providing a centralized platform for the polishing units, reducing the complexity of support requirements compared to holding a single large upper plate.
3Area of stationary object
If a large upper plate is used to polish large substrates, then the polishing area is improved, but the ease of operation deteriorates due to weight and support difficulties
Solution Approach 1:
The upper plate is divided into multiple polishing units that can independently move and polish different regions of the substrate. Each polishing unit has its own driving mechanism, allowing the system to handle large substrates without requiring a single massive upper plate, thus reducing the weight and support requirements.
Solution Approach 2:
The polishing units are designed to move dynamically along the substrate surface rather than relying on a static large upper plate. The driving units enable the polishing units to traverse the substrate, providing the necessary polishing action across large areas while maintaining manageable weight for each individual polishing unit.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the easy polishing of substrates with various sizes by distributing the load and using a stage to support the substrate, allowing for effective removal of protrusions and smoothing of surfaces without the limitations of larger upper plates.
Implementation Method 1
A surface of the substrate is polished by the slurry supplied between the polishing pad and the substrate
Implementation Method 2
a plurality of nozzles disposed at the lower portion of the second moving part and configured to spray slurry to the substrate
Data Source
AI summary
A substrate polishing apparatus includes a support part on which at least one substrate is disposed, a plurality of first moving parts disposed at both opposite sides of the support part in a second direction crossing a first direction, and configured to upwardly extend and reciprocate in the first direction, a second moving part disposed between the plurality of first moving parts in the second direction and connected to an upper side of the first moving parts, a plurality of polishing units disposed at a lower portion of the second moving part and configured to contact an upper surface of the substrate, and a plurality of nozzles disposed at the lower portion of the second moving part and configured to spray slurry to the substrate where the polishing units rotate and revolve along a predetermined trajectory.