Semi-Aromatic Polyamide Composition for Stable Extrusion Molding
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Polyamide resin compositions used in extrusion molding face challenges with increased melt viscosity and reduced residence stability due to high terminal amino group concentrations, leading to pressure increases and compromised flexibility, impact resistance, and chemical resistance, particularly in semi-aromatic polyamides with high melting points.
Innovation Solution
A polyamide resin composition comprising a semi-aromatic polyamide, a polyolefin, and a fatty acid metal salt, with specific ratios and concentrations, and without copper-based stabilizers, to enhance stability and maintain flexibility, chemical resistance, and impact resistance across a wide temperature range.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the terminal amino group concentration is increased to improve chemical resistance, then chemical resistance is improved, but melt viscosity increases and residence stability decreases
Solution Approach 1:
The patent applies parameter changes by precisely controlling the terminal amino group concentration within 45-80 μeq/g and the terminal amino to terminal carboxy group ratio within 2.0-5.0. This optimization resolves the contradiction by finding the optimal parameter range that simultaneously achieves good chemical resistance while preventing excessive melt viscosity increase and maintaining residence stability during extrusion molding.
2Ease of operation
If the addition amount of elastomer is increased to impart flexibility, then flexibility is improved, but melt viscosity increases and residence stability decreases
Solution Approach 1:
The patent uses parameter changes by optimizing the polyolefin content ratio (15-40 mass%) and controlling the terminal amino group concentration (45-80 μeq/g). This balanced parameter optimization achieves the desired flexibility through polyolefin blending while preventing excessive melt viscosity increase, thereby maintaining residence stability during extrusion molding.
3Temperature
If a semi-aromatic polyamide with high melting point is used to improve heat resistance, then heat resistance is improved, but residence stability decreases and pressure increases during extrusion molding
Solution Approach 1:
The patent applies parameter changes by controlling the terminal amino group concentration (45-80 μeq/g) and terminal amino to terminal carboxy group ratio (2.0-5.0) of the semi-aromatic polyamide. This optimization allows the use of high melting point semi-aromatic polyamides for improved heat resistance while preventing excessive pressure increase and maintaining residence stability during extrusion molding through precise parameter control.
4Reliability
If the terminal amino group concentration is increased to improve chemical resistance, then chemical resistance is improved, but pressure increases during extrusion molding
Solution Approach 1:
The patent uses parameter changes by optimizing the terminal amino group concentration (45-80 μeq/g) and terminal amino to terminal carboxy group ratio (2.0-5.0). This balanced parameter optimization achieves good chemical resistance while preventing excessive resin pressure increase during extrusion molding, resolving the contradiction between chemical resistance and processing pressure.
Data Source
AI summary
A polyamide resin composition containing a semi-aromatic polyamide (A), a polyolefin (B), and a fatty acid metal salt (C), and satisfies requirements [1] to [5]: [1] a mass MA of component (A) and a mass MB of component (B) in the composition satisfy MA/MB=60/40 to 85/15; [2] an amount of component (C) in the composition is 0.05 to 0.5% by mass with respect to the total mass of components (A) and (B); [3] a terminal amino group concentration [NH2] of component (A) is 45 to 80 eq/g, and the [NH2] and a terminal carboxy group concentration [COOH] (μeq/g) of component (A) satisfy 2<[NH2]/[COOH]<5; [4] a content ratio of a functional group containing an unsaturated epoxide in component (B)≤200 μmol/g; and [5] a ratio of copper atoms derived from a copper-based stabilizer in the composition ≤200 ppm by mass.