Polyamide Powder Composition for 3D Printing With High Tg
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Solution Overview
Problem
Existing polyamide powders used in 3D printing lack the necessary high glass transition temperature (Tg) and moisture resistance for applications requiring high temperature resistance, while maintaining a low melting temperature to minimize thermal degradation during long printing times.
Innovation Solution
A powdered material comprising polyamide (PA) with a specific composition of 4,4′-diaminodicyclohexylmethane moieties in a trans/trans configuration, combined with a diacid, offering high Tg and low Tm, suitable for 3D printing and high temperature resistance applications.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If polyamides with low melting temperature (Tm < 280°C) are used for 3D printing, then thermal degradation is minimized during printing, but glass transition temperature (Tg) is too low (< 50°C) for high temperature resistance applications
Solution Approach 1:
The patent changes the chemical structure parameters of the polyamide by incorporating cycloaliphatic diamine moieties (specifically 1,3-cyclohexanediamine and/or 1,4-cyclohexanediamine) into the polymer chain. This structural modification raises the glass transition temperature to above 50°C while maintaining the melting temperature below 280°C, thereby improving high-temperature mechanical properties without sacrificing printability
Solution Approach 2:
The patent creates a composite polyamide structure by combining cycloaliphatic diamine units with aliphatic dicarboxylic acid units in specific ratios (30-70 wt% cycloaliphatic diamine). This composite approach at the molecular level achieves both low Tm and high Tg properties that are contradictory in conventional polyamides
2Ease of manufacture
If conventional polyamides (PA12, PA11, PA6) are used for 3D printing, then low melting temperature enables easy processing, but moisture absorption is high requiring drying steps
Solution Approach 1:
The patent modifies the chemical composition parameters by using cycloaliphatic diamines with specific molecular structures that reduce hydrophilicity. The resulting polyamide maintains low melting temperature (below 280°C) for easy processing while reducing moisture absorption through the hydrophobic cyclohexyl rings in the polymer chain
Solution Approach 2:
The patent eliminates the need for separate drying steps (a time-consuming and energy-intensive process) by incorporating moisture-resistant properties directly into the polyamide formulation, making the material ready-to-use without preliminary treatment
3Reliability
If polyamides with high glass transition temperature are developed for high temperature resistance, then mechanical properties at temperature are improved, but melting temperature increases causing thermal degradation during printing
Solution Approach 1:
The patent achieves the unprecedented combination of high Tg (>50°C) and low Tm (<280°C) by changing the molecular architecture parameters - specifically incorporating rigid cyclohexyl rings that elevate Tg while maintaining flexible aliphatic chains that keep Tm low. This dual-structure approach resolves the temperature contradiction
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The PA powder exhibits improved thermal properties, including a Tg above 90°C and low water uptake, enabling effective 3D printing with enhanced mechanical properties and reduced thermal degradation.
Implementation Method 1
such polyamides require a drying step before being used... Such polyamide powders should also advantageously keep their low melting temperature (Tm), so as to minimize their thermal degradation during the typically long printing times
Implementation Method 2
selectively sintering each layer prior to deposition of the subsequent layer, for example by means of an electromagnetic radiation of the powder
Data Source
AI summary
The present invention relates to a process for manufacturing a three-dimensional (3D) article, part or composite material, from a powdered material (M) comprising a polyamide (PA) presenting 4,4′-diaminodicyclohexylmethane moieties, as well as to such powdered material (M). The present invention also relates to the 3D article, part or composite material obtainable from such process, as well as the use of the article, part or composite materials in oil and gas applications, automotive applications, electric and electronic applications, aerospace, medical and consumer goods.