Polygon Pick and Place Head for Micro LED Sub-Pixel Placement
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Solution Overview
Problem
Existing display technologies, particularly in portable devices, face challenges in reducing power consumption and enhancing brightness due to inefficiencies in manufacturing small displays with standard LEDs, which fail to scale effectively for small pixel sizes.
Innovation Solution
A pick and place head (PPH) with a polygon-shaped cross-section and polymeric piezoelectric layers is used to efficiently pick up and place semiconductor devices, such as μLED dies, on a target substrate, allowing for precise placement of arrays of LED dies at sub-pixel locations, improving light emission efficiency and reducing power consumption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If standard manufacturing techniques are used to place LEDs at each pixel, then large displays can be manufactured, but the techniques fail to scale effectively for small pixel sizes in portable devices
Solution Approach 1:
The pick and place head is divided into multiple pick-up surfaces (first pick-up surface, second pick-up surface, etc.) that can independently pick up different semiconductor devices. This segmentation allows parallel processing of multiple devices, enabling the system to handle small pixel sizes while maintaining manufacturing productivity through simultaneous multi-device placement
Solution Approach 2:
The invention transitions from sequential single-device placement to multi-dimensional parallel placement by utilizing multiple pick-up surfaces oriented in different directions. The pick and place head can pick up devices from one substrate and place them on another substrate simultaneously, adding a dimensional aspect to the manufacturing process that overcomes the scalability limitations of traditional techniques
2Productivity
If more semiconductor devices are placed on each pick-up surface, then placement efficiency improves, but precision and accuracy in sub-pixel placement may be compromised
Solution Approach 1:
Each pick-up surface is designed with specific local characteristics optimized for its function. The surfaces can be independently controlled and positioned, allowing each to maintain high precision for its specific placement task while contributing to overall system productivity. This local optimization ensures that even as multiple devices are handled simultaneously, each device receives the precise treatment it requires for accurate sub-pixel placement
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables efficient placement of small LED dies, enhancing brightness levels and extending battery life in portable devices by optimizing light emission and reducing current requirements, while maintaining accuracy and precision in sub-pixel placement.
Implementation Method 1
a polymeric piezoelectric layer surrounding the first electrode layer. The second electrode layer in conjunction with the first electrode layer and the polymeric piezoelectric layer form a contact sensor for PPH to detect mounting or releasing of one or more semiconductor devices
Data Source
AI summary
Embodiments relate to placing of semiconductor devices on a target substrate using a pick and place head (PPH) having a cross-section of a polygon shape and pick-up surfaces. The pick-up surfaces of the PPH are aligned with a carrier substrate mounted with the semiconductor devices, which may be light emitting diodes (LEDs). The PPH is moved toward one or more first semiconductor devices on the carrier substrate to pick up the one or more first semiconductor devices with a first pick-up surface of the PPH. The PPH is rotated to pick up one or more semiconductor devices dies with a second pick-up surface of the PPH. The one or more first semiconductor devices attached to the first pick-up surface and the one or more second semiconductor devices attached to the second pick-up surface are placed on a target substrate.