Polyhydroxyamide Cured Film for Low Stress Copper Adhesion
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Solution Overview
Problem
Conventional cyclized polyimides and polybenzoxazoles with flexible groups face issues of reduced mechanical properties, increased stress on substrates, and poor adhesion to metals like copper, particularly in semiconductor devices.
Innovation Solution
A photosensitive resin composition comprising a polyhydroxyamide with a ring-closure rate of not more than 10% is used to form a cured film, which is applied to substrates, exposed to light, and then heat-treated to achieve high elongation, low stress, and strong adhesion to metals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stress or pressure
If cyclized polyimides or polybenzoxazoles containing flexible groups are used, then stress is reduced, but mechanical properties deteriorate
Solution Approach 1:
The patent changes the chemical structure parameters by using polyhydroxyamide with controlled ring-closure rate (not more than 10%) instead of conventional cyclized polyimides or polybenzoxazoles. This parameter change allows achieving low stress without sacrificing mechanical properties, as the polyhydroxyamide maintains appropriate molecular flexibility while preserving structural integrity.
2Stability of the object's composition
If dehydrating cyclization is promoted during curing of polybenzoxazoles, then ring-closure is enhanced, but stress on substrate increases and adhesion to metals deteriorates
Solution Approach 1:
The patent converts the potentially harmful dehydrating cyclization reaction into a beneficial process by controlling it to occur to a limited extent (ring-closure rate not more than 10%). This controlled partial cyclization provides beneficial adhesion to metal substrates while avoiding the harmful effect of excessive stress generation that would occur with complete cyclization.
3Stability of the object's composition
If dehydrating cyclization is promoted during curing of polybenzoxazoles, then ring-closure is enhanced, but adhesion to metals deteriorates
Solution Approach 1:
The patent optimizes the ring-closure parameter by limiting it to not more than 10%, which creates the ideal balance for metal adhesion. This parameter control ensures that enough cyclization occurs to provide chemical stability and crosslinking, while sufficient hydroxyl groups remain to form strong bonds with metal substrates through coordination or chemisorption.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resulting cured film exhibits high elongation, low stress, and excellent adhesion to metals, enhancing the reliability and mechanical properties of semiconductor devices.
Implementation Method 1
the solubility in the alkaline solution is significantly increased in an exposed portion through the light-induced acid generation by the quinonediazide compound
Implementation Method 2
dehydrating cyclization during the curing of the polybenzoxazoles
Data Source
AI summary
Provided is a cured film of high elongation, low stress, and high adhesion to metal copper. The cured film is formed by curing a photosensitive resin composition, wherein the photosensitive resin comprises a polyhydroxyamide, and wherein the rate of ring-closure of the polyhydroxyamide in the cured film is not more than 10%.