Polyhydroxyamide Resin Composition for Semiconductor Circuit Patterns
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Solution Overview
Problem
Current positive photosensitive resin compositions for semiconductors face challenges in achieving high electric insulating properties, heat resistance, and mechanical strength while avoiding chloride and low-molecule compounds that can corrode electronic materials, and there is a lack of compositions containing polyhydroxyamide resins with a compound generating acid by light irradiation.
Innovation Solution
A positive photosensitive resin composition comprising a polyhydroxyamide resin with a specific structure and a compound generating acid by light irradiation, which forms a high-resolution circuit pattern and exhibits excellent electric insulating properties and heat resistance, synthesized without chloride or low-molecule compounds, allowing for simple synthesis and use in semiconductor applications.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a polyimide-based positive photosensitive resin composition is used to achieve high heat resistance and mechanical strength, then the dissolving rate in alkaline developer becomes excessively high, making it difficult to form precise patterns
Solution Approach 1:
The invention changes the chemical parameters of the resin composition by incorporating polyhydroxyamide resin with specific molecular weight and structure, altering the dissolution behavior in alkaline developer while maintaining heat resistance. This parameter change enables precise pattern formation without sacrificing thermal properties.
2Ease of operation
If a polyhydroxyamide resin is synthesized using dicarboxylic acid chloride and dihydroxyamine under basic condition to achieve adequate solubility in TMAH, then inorganic ions such as chloride ions are present in the reaction solution, causing corrosion in electronic material applications
Solution Approach 1:
The invention extracts and removes inorganic ions (chloride ions) from the reaction solution through purification processes, eliminating the corrosive elements while retaining the beneficial solubility properties of the polyhydroxyamide resin in TMAH developer.
Solution Approach 2:
The invention uses purification intermediaries (such as filtration and washing steps) to separate the desired polyhydroxyamide resin from harmful inorganic ions, enabling the resin to maintain adequate solubility without the corrosive contaminants.
3Object-affected harmful factors
If a polyhydroxyamide resin is synthesized using dicarboxylic acid derivative from 1-hydroxybenzotriazol to avoid chloride ions, then a leaving group derived from the dicarboxylic acid derivative is mixed in the reaction solution, requiring additional removal process
Solution Approach 1:
The invention extracts and removes the leaving group contaminants from the reaction solution through purification steps, simplifying the overall process by eliminating the need for complex additional removal procedures while maintaining the absence of chloride ions.
4Reliability
If the requirements for film physical properties (electric insulating properties, heat resistance, mechanical strength) and high-resolution circuit pattern formation are made more rigid, then the synthesis and purification processes become more complex and costly
Solution Approach 1:
The invention optimizes the molecular weight and structural parameters of the polyhydroxyamide resin to inherently achieve high electric insulating properties and heat resistance, reducing the need for complex purification processes while meeting rigid performance requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition produces a cured film with superior electric insulating properties, heat resistance, and mechanical strength, enabling the formation of high-resolution circuit patterns suitable for semiconductor and circuit board applications without the need for purification, and it does not contain harmful inorganic ions.
Implementation Method 1
a compound (B) generating an acid by light irradiation
Data Source
AI summary
A method for manufacturing a polyhydroxyamide resin (A) containing no chloride includes reacting a coumarin dimer component of Formula (19),where R56, R57, R58, R59, R60 and R61 independently represent an alkyl group having 1 to 10 carbon atom(s), a halogen atom, a nitro group, an amino group, a cyano group, a carboxy group, an alkoxycarbonyl group having 1 to 10 carbon atom(s), a halogenated alkyl group having 1 to 10 carbon atom(s) or a hydroxy group, and a dimamine in a polar solvent.