Photosensitive Material Processing TRIZ Cases

A polymeric resist composition enables negative-tone development with organic solvents to form high-resolution patterns.

A composite rinse solution prevents pattern collapse and melting by reducing surface tension-induced negative pressure on miniaturized ArF resist structures.

A shrink material with an anti-vanishing solvent reduces hole sizes in resist patterns.

A photosensitive resin composition incorporating a hydrophobic phenol-based compound to form fine thin film patterns.

A processing solution containing a nitrogen-containing base and non-ionic surfactant develops negative-working lithographic printing plate precursors.

Alternating dry and wet etching removes residue layers from glass members, enabling high aspect ratio columnar structures with improved shape accuracy.

A novolak resist composition forms high-defined patterns below the resolution limit through a multi-stage curing process.

Automated coating unit deposits hydrophilizing agent on plate margins, preventing edge stains while maintaining print quality and productivity.

A resist composition uses an acid-generator component to modify solubility in organic solvents.

Novolac resin and crosslinking agents prevent fine-pattern collapse during KrF laser exposure.

A polymer washout solvent with ester, ether, and alcoholic components reduces washing time and drying cycles while eliminating hazardous health risks.