Three-Layer Pipeline Structure for Substrate Processing Nozzle
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Solution Overview
Problem
Existing substrate processing apparatuses face challenges in discharging processing liquids without defects, particularly with high-temperature liquids that can thermally deform nozzles, leading to changes in discharge position or state, and require adaptable structures to handle various discharge types, including gas processes.
Innovation Solution
A substrate processing apparatus with a three-layer pipeline structure, where the leading end of the first layer is not protruded beyond the second layer, and both are bonded to the nozzle, allowing for various discharge types without defects, using thermoplastic resin and metal materials for heat resistance and strength, and a surrounding member to suppress dispersion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If high-temperature processing liquid is discharged to enhance resist removal capability, then the resist removal capability is improved, but the nozzle may be thermally deformed causing discharge defects
Solution Approach 1:
The pipeline is divided into three distinct layers with different materials and functions: the first layer (innermost) contacts the high-temperature processing liquid, the second layer (middle) provides structural support, and the third layer (outermost) offers additional protection. This segmentation allows each layer to be optimized for its specific function, preventing thermal deformation from affecting the nozzle directly
Solution Approach 2:
The pipeline uses a composite structure combining different materials in three layers. The first layer uses heat-resistant material to withstand direct contact with high-temperature processing liquid, while the second and third layers provide mechanical strength and structural stability. This composite approach allows the system to handle high temperatures without compromising nozzle precision
2Adaptability or versatility
If a simple nozzle structure is used, then the device complexity is reduced, but it cannot handle various discharge types effectively
Solution Approach 1:
The three-layer pipeline structure serves multiple functions simultaneously: thermal insulation, mechanical support, chemical resistance, and flow control. This universal design allows the same basic structure to handle various discharge types (different temperatures, pressures, and fluid types) without requiring complete redesign, thereby achieving versatility without excessive complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables reliable and defect-free discharge of processing liquids, including high-temperature SPM, across different discharge types, maintaining nozzle integrity and enhancing processing fluid management.
Implementation Method 1
The pipeline has a three-layer structure having a first layer, a second layer and a third layer in this sequence from an inner side thereof... the leading end portion of the first layer is located at a position which is not protruded more than a leading end portion of the second layer with respect to a discharging direction of the processing fluid
Data Source
AI summary
A processing fluid can be discharged according to a discharge type for a process involved, without a discharge defect. A substrate processing apparatus includes a nozzle and a pipeline. The nozzle is configured to discharge the processing fluid toward a substrate, and the processing fluid is supplied to the nozzle through the pipeline. The pipeline has a three-layer structure having a first layer, a second layer and a third layer in this sequence from an inner side thereof. Further, a leading end portion of the first layer and a leading end portion of the third layer are bonded to the nozzle, and the leading end portion of the first layer is located at a position which is not protruded more than a leading end portion of the second layer with respect to a discharging direction of the processing fluid.