Polyimide Release Layer Stripping for Metallic Pattern Formation
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Solution Overview
Problem
Polyimide thin films formed during the process of forming metallic patterns are not readily dissolved in solvents after high-temperature processes, leading to issues where the photoresist cannot be effectively peeled and may remain in devices, affecting their performance.
Innovation Solution
A polyimide resin with improved stripping properties is developed by polymerizing tetracarboxylic dianhydrides, diamines, and phenolamines, where the diamines include hydroxyfluorinated diamines, benzoic acid diamines, and aminotetramethyldisiloxanes. This resin is used to form a release layer, and a stripper mixture of ethylene glycol and diethylene glycol monobutyl ether is used to remove the photoresist layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a polyimide thin film is used as a release layer in the process of forming metallic patterns, then the thermal stability and chemical resistance are improved, but the film becomes difficult to dissolve in stripper after high-temperature processing
Solution Approach 1:
The patent modifies the chemical composition parameters of the polyimide resin by incorporating specific diamine components (hydroxyfluorinated diamines, benzoic acid diamines, and aminotetramethyldisiloxanes) to change the film's solubility characteristics while preserving its thermal stability, enabling effective stripping after high-temperature processing
Solution Approach 2:
The patent creates a composite polyimide resin system combining multiple diamine components with tetracarboxylic dianhydrides to achieve a material that simultaneously provides high thermal stability for release layer functionality and enhanced solubility in stripper for easy removal after metal deposition
2Temperature
If conventional polyimide release layer is used, then thermal resistance is improved, but the photoresist cannot be effectively peeled and may remain in devices
Solution Approach 1:
The patent changes the chemical parameters of the polyimide resin by incorporating specific diamine components that modify the film's interaction with stripper solutions, enabling complete photoresist removal while preserving the thermal resistance needed for high-temperature processing steps
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The polyimide resin with enhanced stripping properties allows for effective removal of the photoresist layer, preventing residual issues and ensuring better device performance. The stripper mixture ensures efficient removal of the composite photoresist during the metallic pattern formation process.
Implementation Method 1
The polyimide resin is obtained by performing a polymerization of tetracarboxylic dianhydrides, diamines, and phenolamines
Implementation Method 2
a stripper mixture of ethylene glycol and diethylene glycol monobutyl ether is used to remove the photoresist layer
Data Source
AI summary
A method of removing a photoresist, a laminate, a method of forming a metallic pattern, a polyimide resin, and a stripper are provided. The method of removing the photoresist includes forming a release layer on a substrate, the release layer having a first surface and a second surface opposite to each other, wherein the first surface of the release layer is in contact with the substrate; forming a photoresist layer on the second surface of the release layer; and removing the release layer and the photoresist layer. The release layer is formed by a polyimide resin. The polyimide resin is obtained by performing a polymerization of tetracarboxylic dianhydrides, diamines, and phenolamines. The diamines include hydroxyfluorinated diamines, benzoic acid diamines, and aminotetramethyldisiloxanes.