Photosensitive Polyimide Developing Solution
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional developing solutions for polyimide precursors have a limited development margin, leading to a decrease in film thickness and pose safety concerns due to the use of toxic solvents like N-methyl-2-pyrrolidone and N,N-dimethylacetamide, which are designated as Substances of Very High Concern.
Innovation Solution
A developing solution comprising N,N,N′,N′-tetramethylurea and a lower alcohol with 1 to 5 carbon atoms, which enhances developability and safety by maintaining film thickness and reducing environmental toxicity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional bipolar aprotic polar organic solvents (N-methyl-2-pyrrolidone, N,N-dimethylacetamide) are used as developing solutions for polyimide precursor, then the developing solution has strong affinity for polyimide precursor and promotes dissolution, but the development margin becomes small and film thickness decreases
Solution Approach 1:
The patent changes the chemical parameters of the developing solution by replacing conventional bipolar aprotic polar organic solvents with N,N,N′,N′-tetramethylurea combined with specific lower alcohols (C1-C5). This parameter change in solvent composition and polarity results in reduced dissolution of the polyimide precursor during development, thereby maintaining film thickness and increasing development margin while still achieving effective pattern formation.
Solution Approach 2:
The patent creates a composite developing solution system by combining N,N,N′,N′-tetramethylurea with specific lower alcohols (C1-C5). This composite solvent system achieves the desired balance between dissolution capability for pattern formation and reduced excessive dissolution, thereby resolving the contradiction between development effectiveness and film thickness maintenance.
2Reliability
If conventional bipolar aprotic polar organic solvents are used in developing solutions, then the developing solution provides effective development processing, but the solvents are designated as Substances of Very High Concern (SVHC) due to strong toxicity
Solution Approach 1:
The patent changes the chemical composition parameters of the developing solution by substituting toxic bipolar aprotic polar organic solvents (SVHC substances) with N,N,N′,N′-tetramethylurea and lower alcohols (C1-C5). This parameter change maintains the necessary dissolution and development processing effectiveness while eliminating the harmful toxicity associated with conventional solvents, thereby resolving the contradiction between processing effectiveness and safety.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a larger development margin, minimizes film thickness reduction, and is safer environmentally, as N,N,N′,N′-tetramethylurea is not a Substance of Very High Concern, ensuring effective permeability and solubility without causing film cracking or whitening.
Implementation Method 1
a developing solution for polyimide precursor, including (a) N,N,N′,N′-tetramethylurea and (b) a lower alcohol having 1 to 5 carbon atoms
Data Source
AI summary
A developing solution for a polyimide precursor containing N,N,N′,N′-tetramethylurea and a lower alcohol having 1 to 5 carbon atoms. The developing solution increases a development margin and results in little or no decrease of the film thickness of a polyimide-based resin film. A development processing method of a photosensitive polyimide resin composition including developing a photosensitive polyimide precursor resin composition, at least a part of which is exposed, with the developing solution; and a pattern formation method including forming a coating film or molding including a photosensitive polyimide precursor resin composition, selectively exposing the coating film or molding, and developing the exposed coating film or molding by the development processing method.