Polyimide Precursor Composition for Low-Loss, Heat-Resistant Films
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Solution Overview
Problem
Existing polyimide films for flexible wiring boards lack both a small dielectric loss tangent and sufficient heat resistance, making them unsuitable for high-frequency applications and as heat-resistant layers in copper-clad laminates.
Innovation Solution
A polyimide precursor composition with specific repeating units, including a combination of aromatic and alicyclic tetracarboxylic acid components and diamines, is used to produce films with a balanced dielectric loss tangent and high heat resistance, suitable for flexible wiring boards and copper-clad laminates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If ester-based diamine compounds are used to reduce dielectric loss tangent, then transmission loss decreases, but heat resistance becomes insufficient
Solution Approach 1:
The invention changes the chemical structure parameters of the diamine component by introducing specific cyclic structures (cycloaliphatic or alicyclic groups) and controlling the ratio of Y1 groups (more than 0 mol% and less than 30 mol%). This structural modification allows the polyimide to achieve both low dielectric loss tangent and high heat resistance simultaneously, resolving the contradiction between transmission loss and heat resistance.
Solution Approach 2:
The invention creates a composite polyimide structure by combining specific tetracarboxylic acid components (X1 groups) with specially structured diamine components (Y1 groups containing cyclic structures). This composite approach at the molecular level enables the material to exhibit both low dielectric loss and high heat resistance properties that neither component could achieve alone.
2Ease of manufacture
If thermoplastic polyimide is used to achieve flexibility, then processability improves, but heat resistance deteriorates
Solution Approach 1:
The invention modifies the chemical composition parameters of the polyimide by incorporating specific cyclic diamine structures and controlling the ratio of Y1 groups. This compositional change enables the polyimide to maintain thermoplastic processability while achieving heat resistance suitable for copper-clad laminate applications, resolving the contradiction between ease of manufacture and heat resistance.
Data Source
AI summary
A polyimide precursor composition for flexible wiring boards, which contains a polyimide precursor having a repeating unit represented by general formula (I).In the formula, more than 0 mol % and less than 30 mol % of Y1 is represented by the formula (1):in formula (1), A is a structure represented by formula (A):n is 1 to 4, m is 0 to 4, B is an alkyl group having 1 to 6 carbon atoms, and U is —CO—O— or —O—CO—.