Polyimide Resin for Low-Temperature Curing and High Resolution
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Solution Overview
Problem
Current photosensitive resin compositions struggle to achieve high resolution, fine pattern formation, and excellent mechanical characteristics, especially when cured at low temperatures, while maintaining good adhesion and insulation properties.
Innovation Solution
A polymer with specific structural units, represented by general formulas (1), (2), (3), and (4), is used as a base resin in positive and negative photosensitive resin compositions. This polymer is soluble in aqueous alkaline solutions, allowing for fine pattern formation and high resolution, and provides excellent mechanical properties even when cured at low temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a closed-ring polyimide resin is used to lower post-curing temperature, then curing temperature is reduced, but mechanical characteristics (elongation and tensile strength) and adhesion deteriorate
Solution Approach 1:
The invention changes the chemical structure parameters of the polyimide resin by introducing specific structural units (formulae 1-4) with flexible spacers and aromatic rings, enabling low-temperature curing while maintaining mechanical properties through molecular design
Solution Approach 2:
The invention creates a composite polymer structure combining rigid aromatic rings for thermal stability with flexible spacer groups for elongation and adhesion, achieving both low curing temperature and excellent mechanical characteristics through structural composition
2Strength
If ester-diamine-containing polybenzoxazole precursor is used to improve mechanical strength, then tensile strength increases, but lithography characteristics (pattern resolution) deteriorate
Solution Approach 1:
The invention applies local quality by positioning specific structural units (formulae 1-4) at different segments of the polymer chain, where aromatic rings provide strength locally while flexible spacers maintain overall pattern resolution capability
Solution Approach 2:
The invention optimizes the molecular weight and structural parameters of the polyimide resin to achieve a balance between mechanical strength and lithography characteristics, enabling high-resolution patterning with improved tensile strength
3Strength
If flexible diamine is incorporated to improve elongation, then mechanical elongation increases, but pattern resolution deteriorates
Solution Approach 1:
The invention precisely controls the length and flexibility parameters of the spacer groups in formulae (1)-(4), optimizing the balance between chain flexibility for elongation and molecular packing for pattern resolution
Solution Approach 2:
The invention creates a composite structure combining rigid aromatic diamine units for resolution with flexible aliphatic diamine units for elongation, achieving both high pattern resolution and excellent mechanical elongation through structural composition
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed solution enables the formation of cured films with improved mechanical strength, adhesiveness, and insulation properties, suitable for use in interlayer insulating films and surface protective films for semiconductor devices.
Implementation Method 1
a polymer comprising: a structural unit represented by the following general formula (1) and/or (2); and a structural unit represented by the following general formula (3) and/or (4)... which are soluble in an aqueous alkaline solution
Implementation Method 2
have excellent mechanical characteristics even when cured at low temperatures
Data Source
AI summary
The present invention is a polymer containing: a structural unit of general formula (1) and/or (2); and a structural unit of general formula (3) and/or (4), where X1 represents a tetravalent organic group, R1 to R4 each represent a monovalent organic group or a hydrogen atom, provided that at least one is a monovalent organic group, L represents a divalent organic group or a divalent atom, X2 represents a divalent organic group, X3 represents a tetravalent organic group, "s" represents 0 or 1, Z represents a divalent bonding group, and X4 represents a divalent organic group. This provides a polymer soluble in an aqueous alkaline solution and usable as a base resin for positive and negative photosensitive resin compositions which enable fine pattern formation, provide high resolution, and have excellent mechanical characteristics even when cured at low temperatures.