Polyimide Solder-Resistant Layer for Semiconductor Positioning
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Semiconductors in high-power applications tend to float or move laterally during soldering due to the lack of lateral guidance, leading to positioning issues and potential mechanical stress, especially when soldered on both sides.
Innovation Solution
A solder-resistant layer, such as a polyimide layer, is applied to the semiconductor to define the solder area and prevent lateral movement by determining the dimensions and shape of the solder area, ensuring the solder remains within a defined region and adheres only to the intended contact surfaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a semiconductor is soldered without lateral guidance measures, then the soldering process is simple and quick, but the semiconductor floats out of position and moves sideward on the substrate
Solution Approach 1:
A solder-resistant layer is applied to the semiconductor surface before the soldering process to predefine the solder area boundaries. This preliminary action ensures that during subsequent soldering, the solder is restricted to the intended region, preventing lateral movement and floating of the semiconductor while maintaining process simplicity
Solution Approach 2:
The solder-resistant layer creates local differentiation on the semiconductor surface by making certain areas solder-resistant while leaving other areas solderable. This local quality variation allows the solder to adhere only to specific regions, providing lateral guidance and positioning stability without complicating the overall soldering process
2Manufacturing precision
If a solder-resistant layer is applied to define the solder area, then lateral movement of the semiconductor is prevented, but additional manufacturing steps are required
Solution Approach 1:
The solder-resistant layer serves multiple functions simultaneously: it defines the solder area boundaries, prevents lateral movement of the semiconductor, and acts as a barrier to solder adhesion on non-contact surfaces. By combining these functions into a single component, the solution achieves high positioning precision without proportionally increasing device complexity
Solution Approach 2:
The solder-resistant layer automatically performs the positioning function during the soldering process itself. As the solder is applied, the layer's solder-resistant properties naturally restrict the solder to the intended area and prevent semiconductor displacement, eliminating the need for separate positioning mechanisms or additional manufacturing steps
3Reliability
If solder is applied to both sides of the semiconductor, then electrical conductivity and heat dissipation are improved, but the semiconductor is more prone to floating and lateral displacement
Solution Approach 1:
Solder-resistant layers are applied to both sides of the semiconductor before bilateral soldering. These pre-applied layers define specific solder areas on each side, ensuring that when solder is applied to both sides for improved conductivity and heat dissipation, the semiconductor remains laterally guided and does not float or displace
Solution Approach 2:
The solder-resistant layers create localized solderable regions on both sides of the semiconductor. This local quality differentiation allows solder to be applied to both sides for enhanced electrical and thermal performance while the restricted solder areas provide anchoring points that prevent lateral movement and maintain positional stability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents semiconductor displacement during soldering, reduces mechanical stress, and enhances electrical conductivity and heat dissipation by maintaining a stable solder area, thereby improving the reliability and service life of high-power semiconductor devices.
Implementation Method 1
Materials, such as for example polyimides, that prevent the layer being wetted with solder are suitable for providing a solder-resistant layer
Implementation Method 2
The semiconductor is surface-connected to at least one first contact partner on at least one first surface by means of providing a first solder layer
Data Source
AI summary
The invention relates to a method for making contact with a semiconductor (10), and to a contact arrangement (1) for a semiconductor (10), wherein the semiconductor (10) is a really connected to a first contact partner (20) at at least one first area by the formation of a first soldering layer (30) having a predefined thickness. According to the invention, a polyimide layer (14) is applied as delimiting means on the semiconductor (10), said polyimide layer predefining the dimensions and/or the form of at least one soldering area (12) of the semiconductor (10).