Polymer Adhesive Composition for High-Temperature Semiconductor Processing
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Solution Overview
Problem
Conventional film adhesives used in semiconductor processing fail to provide sufficient adhesive strength and heat resistance in high-temperature environments, leading to poor adhesion and gas generation, which complicates high-temperature and high-vacuum processing steps such as through-hole electrode formation.
Innovation Solution
A polymer-based adhesive composition is developed with a low-molecular-weight component content of less than 0.3 weight % and a weight-average molecular weight between 10,000 and 300,000, incorporating monomers like styrene, (meth)acrylic acid esters, and N-alkylmaleimides, which improves heat resistance and crack resistance while minimizing gas generation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional film adhesives are used in high-temperature processing, then adhesion is maintained at room temperature, but adhesive strength deteriorates and gas is generated at high temperatures
Solution Approach 1:
The patent changes the chemical composition parameters of the adhesive by using specific monomers (styrene, (meth)acrylic acid esters, N-alkylmaleimides) with controlled polymerization to create a polymer with weight-average molecular weight between 10,000 and 300,000 and low-molecular-weight component content of 0.01-0.3 weight %. This parameter optimization enables the adhesive to maintain strength at high temperatures without gas generation.
Solution Approach 2:
The patent creates a composite adhesive system by combining multiple monomers with different functional groups (styrene for thermal stability, (meth)acrylic acid esters for adhesion, N-alkylmaleimides for heat resistance) to form a copolymer with superior high-temperature performance and minimal gas generation.
2Temperature
If the polymer has high molecular weight to improve heat resistance, then heat resistance is improved, but crack resistance deteriorates
Solution Approach 1:
The patent optimizes the molecular weight parameter by controlling polymerization to achieve a weight-average molecular weight between 10,000 and 300,000, and limits low-molecular-weight component content to 0.01-0.3 weight %. This precise parameter control balances heat resistance and crack resistance, preventing both excessive rigidity and insufficient thermal stability.
3Ease of operation
If low-molecular-weight component content is increased to improve processability, then ease of application is improved, but adhesive strength and heat resistance deteriorate
Solution Approach 1:
The patent sets the low-molecular-weight component content within a narrow range of 0.01-0.3 weight %, which is sufficient for maintaining processability while avoiding the negative effects of excessive low-molecular-weight components on adhesive strength and heat resistance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesive composition exhibits strong adhesion and heat resistance up to 200°C, reducing gas generation and crack formation, making it suitable for high-temperature and high-vacuum semiconductor processing applications.
Implementation Method 1
a polymer prepared by polymerizing a monomer composition containing a polymerizable group
Implementation Method 2
exhibits strong adhesion and heat resistance up to 200°C
Implementation Method 3
a film adhesive for processing is attached on the circuit pattern surface
Data Source
AI summary
An adhesive composition is disclosed which includes a polymer prepared by copolymerizing a monomer containing a polymerizable group, the polymer including a low-molecular-weight component having a molecular weight equivalent to 1% or less of the weight-average molecular weight of the polymer, the low-molecular-weight component is contained in a range of not less than 0 weight % to less than 0.3 weight % of the total weight of the polymer. This allows provision of an adhesive composition having great adhesive strength in a high-temperature environment, especially at temperatures from 140° C. to 200° C., as well as high heat resistance and favorable crack resistance.