Laminated Polymer Capacitor Heavy-Edge Structure for Capacity Retention
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Solution Overview
Problem
Existing thin film high polymer laminated capacitors face a decrease in electrostatic capacity due to the narrowing of the vapor-deposited metal width in the capacitor region caused by the accumulation of metal on the boundary parts of the vapor deposition mask during lamination, leading to issues with electrostatic capacity and contact to external electrodes.
Innovation Solution
A novel structure with a laminated capacitor function region having a smaller electrode thickness and edge regions with a heavy edge structure, achieved through a manufacturing process that alternately laminates dielectric and internal electrode layers, using a vapor deposition mask to shield the capacitor function region and form a heavy edge, ensuring consistent width and thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the opening of the vapor deposition mask is expanded to increase metal layer thickness, then the thickness of the vapor-deposited metal is increased, but the vapor-deposited metal accumulates on the boundary part of the slit through lamination, narrowing the opening width and decreasing the electrostatic capacity
Solution Approach 1:
The internal electrode layer is segmented into two distinct regions: a capacitor function region with smaller metal layer thickness and edge regions with larger metal layer thickness. This segmentation allows each region to have optimized thickness for its specific function, preventing the accumulation problem while maintaining good contact
Solution Approach 2:
Different regions of the internal electrode layer are given different metal layer thicknesses according to their functional requirements. The capacitor function region has thinner layers to maintain opening width and electrostatic capacity, while the edge regions have thicker layers to ensure good contact with external electrodes
2Manufacturing precision
If the vapor deposition mask slit opening is expanded in both circumferential and perpendicular directions, then the metal layer thickness is increased, but the width of the vapor-deposited metal in the capacitor region is narrowed through lamination
Solution Approach 1:
The electrode structure is divided into capacitor function region and edge region, allowing the capacitor region to maintain its width while the edge region provides the necessary thickness for contact
Solution Approach 2:
The vapor deposition mask is designed with different opening dimensions for different regions before the lamination process begins. The capacitor function region has a smaller opening to prevent accumulation, while the edge region has a larger opening to ensure sufficient thickness from the start
3Reliability
If a heavy edge structure is formed by increasing metal thickness, then good contact to external electrodes is achieved, but the electrostatic capacity is decreased due to narrowing of the capacitor region
Solution Approach 1:
The internal electrode layer is segmented into capacitor function region and edge region, allowing the edge region to provide heavy edge structure for good contact while the capacitor function region maintains appropriate width for electrostatic capacity
Solution Approach 2:
The metal layer thickness is locally optimized: thinner in the capacitor function region to maintain width and capacity, and thicker in the edge region to ensure reliable contact with external electrodes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables good contact to external electrodes, enhances withstanding voltage characteristics, and maintains target electrostatic capacity by preventing the narrowing of the capacitor region width during lamination, while allowing for efficient production.
Implementation Method 1
formed by continuously vapor-depositing dielectric layers and internal electrode layers in vacuum
Implementation Method 2
irradiating the monomer layer to form the dielectric layer
Data Source
AI summary
A thin film high polymer laminated capacitor includes: a laminated chip including dielectric layers, and internal electrode layers including first metal layers including a first metal vapor-deposited on the dielectric layers, and second metal layers including a second metal vapor-deposited on the first metal layers. The dielectric layers and the internal electrode layers are laminated and bonded alternately, and external electrodes are formed on one end and the other end of the laminated chip. The laminated chip includes a first region having the first metal layers formed on the dielectric layers, which are laminated alternately, and edge regions having the second metal layers formed on layers connected to the one end and layers connected to the other end in the first metal layers, which are laminated alternately, the first region having a capacitor function region, and the edge region having a heavy edge.