Polymer Optical Filter Integration on Semiconductor Wafer
Solution Overview
Problem
The manufacturing of CMOS imagers is hindered by a complex structure and high cost due to the need for a separate infrared filter, which requires dedicated manufacturing lines and extensive assembly time.
Innovation Solution
A multi-layer optical filter is integrated onto the semiconductor wafer using polymer materials with varying optical indices, eliminating the need for a distinct filter by incorporating filtering functionality into the glass plate attachment process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a separate infrared filter is used in the module, then the filtering function is achieved, but the device complexity and manufacturing cost increase
Solution Approach 1:
The patent merges the infrared filtering function with the glass plate by depositing polymer material layers directly onto the glass plate surface. This integration eliminates the need for a separate filter component, reducing device complexity while maintaining the filtering function. The glass plate thus serves dual purposes: structural support and optical filtering.
Solution Approach 2:
The glass plate is transformed into a multi-functional component by endowing it with both its original structural/support function and an additional optical filtering function through the polymer coating. This universalization reduces the total number of components needed in the module.
2Productivity
If a separate infrared filter is used, then the filtering function is provided, but the assembly time and manufacturing cost increase
Solution Approach 1:
The filter manufacturing process is merged with the glass plate production process. The polymer material is deposited onto the glass plate in the same production line, eliminating separate filter manufacturing and assembly steps. This integration directly reduces assembly time and manufacturing cost.
Solution Approach 2:
The filtering function is prepared in advance by depositing the polymer layers onto the glass plate during its production, before the glass plate is assembled into the final module. This preliminary action eliminates the need for separate filter installation during module assembly.
3Device complexity
If polymer material layers are deposited on the wafer, then the optical filter function is integrated, but additional manufacturing steps are required
Solution Approach 1:
The mechanical assembly of separate filter and glass plate components is replaced by a chemical/depositional process where polymer material is deposited directly onto the glass plate. This substitution integrates the filtering function into the material structure rather than requiring mechanical assembly of separate parts.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the assembly and reduces costs by integrating the filtering function directly onto the wafer, enabling cost-effective production of CMOS imagers with equivalent image quality without the need for additional filter components.
Implementation Method 1
depositing, on the front face of the wafer, at least one layer of a polymer material forming an optical filter
Implementation Method 2
depositing, on the front face of the wafer, at least one layer of a polymer material
Data Source
AI summary
A method manufactures semiconductor chips each comprising a component implanted in the semiconductor. The method includes collectively implanting components onto a front face of a semiconductor wafer and fixing a plate of a transparent material onto the front face of the wafer. Fixing the plate of transparent material is preceded by a step of depositing, on the front face of the wafer, at least one layer of polymer material forming an optical filter. Application is particularly to the manufacturing of imagers.