Polymer Substrate for Power Modules via Frontal Ring-Opening Polymerization
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Solution Overview
Problem
Conventional power electronic modules require multiple layers for heat management, leading to significant thermal resistance and limited size reduction, as they use solder layers to couple components, which hinder effective heat removal and increase operating temperatures.
Innovation Solution
The use of a polymer formed via frontal ring-opening polymerization (FROMP) method, such as poly(dicyclopentadiene), allows for the direct formation of a substrate on the base plate, eliminating the need for additional solder layers and reducing thermal resistance, while maintaining high thermal conductivity and dielectric strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple layers including solder layers are used to couple components, then the structural integrity and electrical connectivity are maintained, but the thermal resistance increases and the module size increases
Solution Approach 1:
The patent combines the substrate and base plate into a single integrated component made of thermally conductive polymer composite material. This merging eliminates the solder layer and reduces the number of discrete layers from 5-7 to essentially one functional layer, thereby reducing thermal resistance while maintaining structural integrity through the unified composite structure.
Solution Approach 2:
The invention uses composite materials consisting of thermally conductive fillers (such as aluminum oxide, aluminum nitride, or boron nitride) embedded in a polymer matrix. This composite material provides both the mechanical strength needed for structural integrity and the high thermal conductivity required to reduce thermal resistance, replacing the traditional multi-layer metal and solder construction.
2Reliability
If multiple layers including solder layers are used to couple components, then the structural integrity and electrical connectivity are maintained, but the module size increases
Solution Approach 1:
The patent combines the substrate and base plate into a single integrated component made of thermally conductive polymer composite material. This merging eliminates the solder layer and reduces the number of discrete layers from 5-7 to essentially one functional layer, thereby reducing thermal resistance while maintaining structural integrity through the unified composite structure.
Solution Approach 2:
The invention uses composite materials consisting of thermally conductive fillers (such as aluminum oxide, aluminum nitride, or boron nitride) embedded in a polymer matrix. This composite material provides both the mechanical strength needed for structural integrity and the high thermal conductivity required to reduce thermal resistance, replacing the traditional multi-layer metal and solder construction.
3Reliability
If conventional substrates with multiple layers are used, then electrical insulation and structural support are provided, but thermal conductivity is insufficient
Solution Approach 1:
The invention uses composite materials consisting of thermally conductive fillers (such as aluminum oxide, aluminum nitride, or boron nitride) embedded in a polymer matrix. This composite material provides both the mechanical strength needed for structural integrity and the high thermal conductivity required to reduce thermal resistance, replacing the traditional multi-layer metal and solder construction.
Solution Approach 2:
The patent applies local quality by creating regions of high thermal conductivity within the polymer composite material through the strategic distribution of thermally conductive fillers. The composite structure provides different properties in different regions - electrical insulation from the polymer matrix and thermal conductivity from the filler particles - thereby simultaneously achieving electrical insulation and high thermal conductivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the number of layers, enhancing thermal conductivity and minimizing the size of the power electronic module, thereby improving heat management and operational temperatures of power semiconductor devices.
Implementation Method 1
initiating a polymerization front within the solution to produce a substrate formed directly on the base plate
Data Source
AI summary
In one or more embodiments of the present disclosure, a power electronic module may be described. The power electronic module may comprise a power semiconductor device, a substrate coupled to the power semiconductor device, and a base plate coupled to the substrate. The substrate may include from 50 weight percent (wt. %) to 99.9 wt. % of a poly(dicyclopentadiene) polymer. In one or more other embodiments of the present disclosure, a method for manufacturing a power electronic module may be described. The method may include disposing a solution on a base plate. The solution may include dicyclopentadiene monomer, a ruthenium-based catalyst, and a trialkyl phosphite initiator. The method may further include initiating a polymerization front within the solution to produce a substrate formed directly on the base plate. Furthermore, the method may include coupling a power semiconductor device on the substrate to produce the power electronic module.