Electric Component Polymer Layer Switching Structure

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Solution Overview

Problem

The production of electric components with mechanically active chips is complex and costly, resulting in non-optimal durability due to sensitive component structures and complex interconnections.

Innovation Solution

An electric component design featuring a support substrate with a polymer layer, a chip with a connection structure and a metallic switching structure on its underside, where the switching structure penetrates through the polymer layer for electrical connections and the connection structure establishes a mechanical connection, allowing for simple and robust assembly.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If complex production methods are used to produce electric components with interconnected chips, then manufacturing precision can be improved, but device complexity and production costs increase

Engineering Contradiction:

Improveproduction precisionVSAvoidproduction complexity

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The invention divides the chip structure into functionally distinct elements: a connection structure for mechanical attachment and a switching structure for electrical connections. This segmentation allows each structure to be optimized independently and simplifies the production process by enabling separate fabrication and assembly steps.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent introduces a polymer layer as an intermediary between the chip and the support substrate. This polymer layer facilitates both mechanical bonding and electrical connectivity, acting as a mediator that simplifies the overall assembly process while maintaining manufacturing precision.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Adaptability or versatility

If mechanically active chips are integrated into electric components, then functionality is improved, but reliability decreases due to sensitive component structures

Engineering Contradiction:

Improvefunctional capabilityVSAvoidcomponent durability

Core Design Contradiction:

Adaptability or versatilityVSReliability

Solution Approach 1:

The polymer layer serves as a cushioning element that protects mechanically active chips from external stresses and environmental influences. By placing this protective layer beforehand during assembly, the chip's sensitive structures are shielded while maintaining their functional capabilities.

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

Solution Approach 2:

The patent employs a flexible polymer layer that conforms to the chip structure and provides mechanical protection. This thin film approach allows the mechanically active chip to be protected without adding significant bulk or complexity to the component.

Inventive Principle:

Principle #30Flexible shells and thin films

3Reliability

If through-connections are created through the support substrate, then electrical connectivity is improved, but manufacturing complexity increases

Engineering Contradiction:

Improveelectrical connectivityVSAvoidproduction simplicity

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The polymer layer acts as an intermediary that enables electrical through-connections without requiring complex substrate penetration. The switching structure passes through the polymer layer to establish electrical connections, simplifying the manufacturing process compared to traditional methods that require drilling or etching through rigid substrates.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent changes the physical state of the polymer layer during production, utilizing its soft or liquid state during assembly to facilitate easy penetration by the switching structure, then curing it to establish stable electrical connections. This parameter change simplifies the manufacturing process significantly.

Inventive Principle:

Principle #35Parameter changes

4Adaptability or versatility

If multiple chips are integrated into a single component, then functionality is improved, but production complexity increases

Engineering Contradiction:

Improvechip integration capabilityVSAvoidassembly complexity

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The polymer layer provides multiple functions simultaneously: mechanical support, electrical insulation, and facilitation of electrical connections. This multi-functionality allows multiple chips to be integrated into a single component without proportionally increasing assembly complexity, as the same polymer layer serves all chips.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design reduces production errors, increases component lifespan, and enables the integration of multiple chips with enhanced mechanical and electrical stability, while maintaining a protective environment for sensitive structures.

Implementation Method 1

subsequently curing the polymer layer

Methodology Applied

Scientific EffectCuring: Photopolymerisation

Implementation Method 2

curing the polymer layer

Methodology Applied

Scientific EffectCuring:

Data Source

PatentUS11245977B2Electric component with sensitive component structures and method for producing an electric component with sensitive component structures

Publication Date: 2022.02.08 SNAPTRACK INC

AI summary

The invention relates to a simple to produce electric component for chips with sensitive component structures. Said component comprises a connection structure and a switching structure on the underside of the chip and a support substrate with at least one polymer layer.