Polymeric-Shell Porogens for Uniform CMP Subpad Pores

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Solution Overview

Problem

Existing polishing pads for chemical mechanical planarization (CMP) exhibit variable mechanical properties due to non-uniform pore formation, leading to inconsistent polishing performance.

Innovation Solution

The use of porogens with polymeric shells in the subpad structure to control pore size and prevent interconnection, resulting in a more uniform and stable CMP pad.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Stability of the object's composition

If gas-filled pores are formed through chemical or physical blowing agents, then porous structure is achieved, but pore uniformity deteriorates and mechanical properties become variable

Engineering Contradiction:
Improvepore uniformityVSAvoidmechanical property consistency
Core Design Contradiction:
Stability of the object's compositionVSReliability

Solution Approach 1:

The patent divides the porous structure into discrete, isolated pores separated by polymeric shell barriers. Each pore is individually encapsulated, preventing interconnection and ensuring uniform distribution throughout the subpad matrix, thereby achieving consistent mechanical properties across different batches.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The polymeric shell acts as an intermediary barrier between adjacent pores, preventing their coalescence and interconnection. This intermediary structure maintains pore isolation and uniformity, leading to predictable and consistent mechanical behavior of the CMP pad.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Quantity of substance

If larger pores are formed, then porosity is increased, but polishing uniformity deteriorates

Engineering Contradiction:
ImproveporosityVSAvoidpolishing uniformity
Core Design Contradiction:
Quantity of substanceVSManufacturing precision

Solution Approach 1:

The patent controls pore size as a critical parameter, specifying pores with diameters between 1-100 micrometers. This parameter control ensures adequate porosity for mechanical properties while maintaining uniformity required for consistent polishing performance across the substrate surface.

Inventive Principle:
Principle #35Parameter changes

3Quantity of substance

If pores are interconnected, then porosity is enhanced, but structural control deteriorates

Engineering Contradiction:
ImproveporosityVSAvoidpore structure control
Core Design Contradiction:
Quantity of substanceVSStability of the object's composition

Solution Approach 1:

The patent extracts the harmful effect of pore interconnection by introducing polymeric shell barriers that physically separate adjacent pores. This extraction of connectivity maintains high porosity while preventing uncontrolled pore networks, thereby preserving structural integrity and compositional stability.

Inventive Principle:
Principle #2Taking out (Extraction)

Data Source

PatentUS12459076B2Chemical-mechanical polishing subpad having porogens with polymeric shells
Publication Date: 2025.11.04 CMC MATERIALS INC
  • US12459076B2 patent drawing
  • US12459076B2 patent drawing
  • US12459076B2 patent drawing

AI summary

A subpad for a chemical-mechanical polishing pad, the subpad having porogens with polymeric shells. Methods of fabricating the subpad and polishing pads with a polishing surface layer bonded to the subpad layer are also described.