Polyphenylene Ether Resin Composition for Low Warpage

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Solution Overview

Problem

Polyphenylene ether resin compositions used in high-frequency electronic devices face challenges in suppressing warpage while maintaining excellent dielectric characteristics, as they tend to have a large coefficient of thermal expansion, which affects connection reliability and mounting reliability in semiconductor packages.

Innovation Solution

A polyphenylene ether resin composition is developed, featuring a modified polyphenylene ether copolymer with a carbon-carbon unsaturated double bond at the molecular chain end, combined with a high-molecular-weight compound having a glass transition temperature of 20° C. or lower, and a crosslinking agent with multiple unsaturated double bonds, which phase separates in the cured state to reduce thermal expansion and enhance dielectric properties.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If polyphenylene ether resin composition is used to achieve excellent dielectric characteristics, then dielectric constant and dielectric dissipation factor are improved, but coefficient of thermal expansion increases causing warpage

Engineering Contradiction:

Improvedielectric characteristicsVSAvoidcoefficient of thermal expansion

Core Design Contradiction:

ReliabilityVSStability of the object's composition

Solution Approach 1:

The patent uses a composite resin system combining modified polyphenylene ether copolymer with unsaturated double bonds and high-molecular-weight compound, creating a multi-phase structure that achieves both low dielectric constant and reduced thermal expansion coefficient, resolving the contradiction between dielectric performance and thermal stability

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The patent modifies the molecular structure by introducing unsaturated double bonds at chain ends and controlling molecular weight parameters, which changes the physical and chemical properties of the resin to simultaneously achieve excellent dielectric characteristics and reduced thermal expansion

Inventive Principle:

Principle #35Parameter changes

2Temperature

If modified polyphenylene ether copolymer with crosslinking agent is used to enhance heat resistance, then Tg is improved, but warpage control becomes difficult

Engineering Contradiction:

Improveglass transition temperatureVSAvoidwarpage

Core Design Contradiction:

TemperatureVSShape

Solution Approach 1:

The patent creates local phase separation within the resin composition where crosslinked regions provide high heat resistance while non-crosslinked regions maintain flexibility and accommodate thermal stress, preventing warpage while achieving high Tg

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The high-molecular-weight compound acts as an intermediary that moderates the rigidifying effect of crosslinking, allowing the system to achieve high glass transition temperature while maintaining dimensional stability and reducing warpage

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The composition achieves a cured product with reduced warpage and improved dielectric characteristics, maintaining high heat resistance and adhesiveness, and is suitable for producing prepregs, metal-clad laminates, and printed wiring boards with enhanced reliability and signal speed.

Implementation Method 1

The modified polyphenylene ether copolymer is phase separated from the high-molecular-weight compound in a cured state of the polyphenylene ether resin composition

Methodology Applied

Scientific EffectPhase separation:

Implementation Method 2

a high-molecular-weight compound having a number-average molecular weight Mn ranging from 1000 to 10000, inclusive and having a glass transition temperature (Tg) of 20° C. or lower

Methodology Applied

Scientific EffectGlass transition:

Implementation Method 3

The crosslinking agent has at least two carbon-carbon unsaturated double bonds per molecule

Methodology Applied

Scientific EffectCrosslinking:

Data Source

PatentUS11066548B2Polyphenylene ether resin composition, prepreg, metal-clad laminate, and printed wiring board

Publication Date: 2021.07.20 PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD

AI summary

A polyphenylene ether resin composition includes a modified polyphenylene ether copolymer, a high-molecular-weight compound, and a crosslinking agent for the modified polyphenylene ether copolymer. The modified polyphenylene ether copolymer includes a substituent having a carbon-carbon unsaturated double bond at a molecular chain end of the modified polyphenylene ether copolymer. The high-molecular-weight compound has a glass transition temperature (Tg) measured by differential scanning calorimetry of 20° C. or lower and has a number-average molecular weight Mn ranging from 1000 to 10000, inclusive. The crosslinking agent includes at least two carbon-carbon unsaturated double bonds per molecule, and includes at least one of dicyclopentadiene acrylate and dicyclopentadiene methacrylate. In a cured state of the polyphenylene ether resin composition, the modified polyphenylene ether copolymer is phase separated from the high-molecular-weight compound.