Polyurethane Polishing Pad with Aromatic Additives for Planarity
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Solution Overview
Problem
Conventional polishing pads face challenges in achieving efficient dressing and maintaining surface hardness, leading to increased dressing time and potential scratches on semiconductor wafers during planarization processes.
Innovation Solution
A polishing pad with a polyurethane resin foam layer containing an isocyanate component, a polyol component, and an aromatic compound with one hydroxyl or amino group, which reduces the toughness of the resin while maintaining hardness, thereby improving dressing efficiency and preventing scratches.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a polishing pad with high elastic modulus is used to improve planarity, then the planarity of the polished object is improved, but the polishing rate decreases
Solution Approach 1:
The invention changes the chemical composition parameters of the polyurethane resin by incorporating specific aromatic compounds (phenolic compounds, carboxylic acid compounds, or amide compounds) in controlled amounts (0.1-10 mass%). This compositional parameter change allows optimization of both the elastic modulus for planarity and the polishing rate, resolving the trade-off between precision and productivity
Solution Approach 2:
The invention creates a composite polyurethane resin system by combining isocyanate-terminated prepolymer with specific aromatic compounds as additives. This composite material approach enables simultaneous achievement of high planarity (through controlled elastic modulus) and high polishing rate (through optimized slurry holding in foam cells), resolving the contradiction between manufacturing precision and productivity
2Manufacturing precision
If the surface of the polishing pad is dressed for a predetermined period to remove fine uneven portions, then the planarization characteristics are improved, but the dressing time increases excessively
Solution Approach 1:
The invention performs preliminary action by incorporating specific aromatic compounds during the resin synthesis stage, which pre-optimizes the surface properties and structural uniformity of the polishing pad. This preliminary compositional adjustment reduces the need for extended dressing operations, thereby decreasing dressing time while maintaining excellent planarization characteristics
Solution Approach 2:
By changing the chemical composition parameters of the polyurethane resin (adding aromatic compounds in specific amounts), the invention modifies the surface formation characteristics and structural uniformity of the polishing pad, enabling faster dressing cycles while achieving the required planarization performance
3Manufacturing precision
If a polymerized diisocyanate is used to increase hardness, then the planarity is improved, but scratches occur on the surface of the object to be polished
Solution Approach 1:
The invention changes the chemical composition by introducing aromatic compounds (phenolic, carboxylic acid, or amide compounds) in controlled amounts (0.1-10 mass%). This compositional parameter change modifies the resin's mechanical properties to achieve the right balance: sufficient hardness for planarity while maintaining surface smoothness to prevent scratches on the polished object
Solution Approach 2:
The invention applies local quality by differentiating the functional roles of different components: the polyurethane resin matrix provides the bulk mechanical properties for planarity, while the aromatic compound additives specifically influence surface characteristics to prevent scratching, allowing each component to optimize its local function
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly reduces dressing time and prevents scratches on semiconductor wafers, enhancing the production efficiency of semiconductor wafers by improving the cut rate and extending the lifespan of the polishing pad.
Implementation Method 1
a polishing rate can be bettered by increasing a holding quantity of a slurry on a foam with cells therein
Implementation Method 2
the polyurethane resin foam contains, as starting material components, (A) an isocyanate component, (B) a polyol component, and (C) an aromatic compound having one hydroxyl group and/or an aromatic compound having one amino group
Data Source
AI summary
The purpose of the present invention is to provide: a polishing pad which has improved dressing properties, while maintaining the hardness; or a polishing pad which does not easily make a scratch on the surface of an object to be polished, while having improved dressing properties. A polishing pad of the present invention is characterized by having a polishing layer that is formed of a polyurethane resin foam or an unfoamed polyurethane resin, and is also characterized in that the polyurethane resin foam or the unfoamed polyurethane resin contains, as starting material components, (A) an isocyanate component, (B) a polyol component and (C) an aromatic compound that has one hydroxyl group and/or an aromatic compound that has one amino group.