Package-on-Package Layout Without Dielectric Layers
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Solution Overview
Problem
The semiconductor industry faces challenges in achieving compact and reliable package-on-package (PoP) structures due to the complexity and thickness of conventional packaging processes, which hinder the integration density and efficiency of electronic components.
Innovation Solution
The method involves forming a first redistribution structure on a carrier with a de-bonding layer, followed by the placement of a die and conductive structures, encapsulation, and the creation of a second redistribution structure directly on the encapsulant without intermediate dielectric layers, allowing for flip-chip bonding and reduced thickness, thereby enhancing integration density and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional packaging processes are used with intermediate dielectric layers, then structural completeness is maintained, but overall thickness increases and integration density decreases
Solution Approach 1:
The patent removes intermediate dielectric layers from the package structure, extracting only the essential components (redistribution structures, die, encapsulant) while eliminating unnecessary layers. This extraction principle directly reduces overall thickness while maintaining the core functional integrity of the package structure.
Solution Approach 2:
The patent employs thin film structures for the redistribution layers and encapsulant, replacing thick dielectric layers. The use of thin film technology enables significant thickness reduction while maintaining electrical and mechanical functionality, directly addressing the contradiction between thickness reduction and structural completeness.
2Ease of manufacture
If multiple intermediate layers are included in the package structure, then structural stability is improved, but manufacturing complexity and production costs increase
Solution Approach 1:
By removing intermediate dielectric layers and unnecessary structural elements, the patent simplifies the manufacturing process while retaining essential structural stability through the optimized combination of redistribution structures, die, and encapsulant.
Solution Approach 2:
The patent merges multiple functional layers into integrated structures, such as combining redistribution functionality directly with the encapsulant interface, thereby reducing the number of separate manufacturing steps and simplifying production while maintaining structural integrity.
3Manufacturing precision
If conventional package structures with intermediate dielectric layers are used, then void issues are reduced, but planarity and integration density are compromised
Solution Approach 1:
The use of thin film encapsulant and redistribution structures eliminates the need for thick dielectric layers, achieving superior planarity while reducing void formation through improved material conformality and reduced layer interfaces.
Data Source
AI summary
A package-on-package (PoP) structure includes a first package structure and a second package structure stacked on the first package structure. The first package structure includes a die, conductive structures, an encapsulant, and a conductive pattern layer. The conductive structures surround the die. The encapsulant laterally encapsulates the die and the conductive structures. The conductive pattern layer is disposed over and in physical contact with a top surface of the encapsulant and top surfaces of the conductive structures. An entire bottom surface of the conductive pattern layer is located at a same level height, and an entirety of the top surface of the encapsulant and an entirety of the top surfaces of the conductive structures are located at the same level height.