PoP IC Package Thermal Brace for TIM Pressure and Wafer Protection
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Solution Overview
Problem
The semiconductor industry faces challenges in achieving high integration density and effective thermal management in package-on-package (PoP) devices, particularly in high power systems, where high thermal cooling requirements necessitate high pressures on thermal interface materials (TIM) to reduce thermal resistance, and existing packaging techniques may cause damage to integrated fan-out wafers during drilling and screwing processes.
Innovation Solution
A package design utilizing a mechanical brace with compression parts to enhance TIM pressure, integrated with a thermal management system, which includes a redistribution structure and a thermal interface material to secure thermal modules, ensuring reliable thermal cycling and preventing damage to the wafer during assembly processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If mechanical brace with compression parts is used to apply enhanced pressure to thermal interface materials, then thermal management efficiency is improved, but device complexity increases
Solution Approach 1:
The mechanical brace is divided into a body portion and multiple compression parts (fasteners), allowing the pressure application function to be distributed across multiple discrete elements that can be independently positioned and adjusted on different thermal modules
Solution Approach 2:
The mechanical brace structure serves multiple functions: it provides structural support for the package, applies compressive force to multiple thermal interface materials simultaneously, and enables thermal management across different power modules within the same package
2Temperature
If drilling and screwing processes are used to secure thermal modules, then thermal management integration is improved, but risk of damage to integrated fan-out wafers increases
Solution Approach 1:
The mechanical brace structure is designed and positioned before the drilling process, allowing the locations of drill holes to be pre-determined in areas that avoid sensitive integrated fan-out wafer regions, thus preventing damage before it occurs
Solution Approach 2:
The mechanical brace body acts as an intermediary structure that distributes the mounting load across multiple points and provides a stable platform for securing thermal modules without concentrating stress on vulnerable wafer areas
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides enhanced thermal management and reliability by maintaining TIM pressure above 30 psi, reducing thermal resistance, and preventing damage to the integrated fan-out wafer, suitable for high power systems in computing and data centers.
Implementation Method 1
a mechanical brace to secure the first thermal module and the second thermal module. The mechanical brace includes a body, a first compression part, and a second compression part. The first compression part extends through the body and is configured to physically contact the first thermal module. The second compression part extends through the body and is configured to physically contact the second thermal module.
Data Source
AI summary
An embodiment includes a first package component including a first integrated circuit die and a first encapsulant at least partially surrounding the first integrated circuit die. The device also includes a redistribution structure on the first encapsulant and coupled to the first integrated circuit die. The device also includes a first thermal module coupled to the first integrated circuit die. The device also includes a second package component bonded to the first package component, the second package component including a power module attached to the first package component, the power module including active devices. The device also includes a second thermal module coupled to the power module. The device also includes a mechanical brace extending from a top surface of the second thermal module to a bottom surface of the first thermal module, the mechanical brace physically contacting the first thermal module and the second thermal module.