POP Substrate Heat Transfer Portion Thermal Management
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Solution Overview
Problem
Mixed memory-logic POP stacks experience poor thermal performance due to the memory package blocking heat dissipation from the processor and a small air gap hindering heat transfer, which limits processor performance.
Innovation Solution
The electronic device POP configuration eliminates the air gap between packages by incorporating a substrate with a thermally conductive heat transfer portion that facilitates heat transfer from the processor through the substrate, allowing for direct thermal conduction to the memory package, thereby enhancing cooling efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If a memory package is stacked on a logic package in traditional POP configuration, then space savings on PCB is achieved, but thermal performance deteriorates due to air gap blocking heat dissipation
Solution Approach 1:
A thermally conductive substrate is introduced as an intermediary between the logic package and memory package. This substrate acts as a heat transfer medium that conducts heat away from the logic package through its thickness to the memory package, eliminating the need for an air gap while maintaining thermal performance. The substrate's thermal conductivity enables efficient heat transfer across the package stack.
Solution Approach 2:
The invention changes the thermal parameter of the interface between packages by replacing air (low thermal conductivity) with a thermally conductive substrate material. This parameter change transforms the thermal resistance at the package interface, enabling heat to flow through the substrate thickness rather than being blocked by an air gap, thus improving overall thermal performance.
2Adaptability or versatility
If an air gap is maintained between packages for manufacturing tolerances, then assembly flexibility is improved, but heat transfer capability deteriorates
Solution Approach 1:
The thermally conductive substrate serves as a mediator that simultaneously addresses both manufacturing tolerance and heat transfer requirements. It provides a physical interface that accommodates dimensional variations while its high thermal conductivity ensures efficient heat transfer, replacing the dual-function air gap with a purpose-built thermal interface layer.
Solution Approach 2:
The substrate performs multiple functions: it provides mechanical support, accommodates manufacturing tolerances through its thickness, enables thermal conduction from the logic package, and serves as a mounting surface for the memory package. This multi-functionality replaces the air gap's limited tolerance accommodation with a more versatile component that also enhances thermal performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration provides superior heat dissipation, potentially improving thermal performance by 5 times over traditional POP stacks, allowing for higher processor performance without increasing board area or sacrificing battery capacity.
Implementation Method 1
a substrate having a heat transfer portion that facilitates heat transfer through a thickness of the substrate
Data Source
AI summary
Electronic device package on package (POP) technology is disclosed. A POP can comprise a first electronic device package including a heat source. The POP can also comprise a second electronic device package disposed on the first electronic device package. The second electronic device package can include a substrate having a heat transfer portion proximate the heat source that facilitates heat transfer from the heat source through a thickness of the substrate. The substrate can also have an electronic component portion at least partially about the heat transfer portion that facilitates electrical communication. In addition, the POP can comprise an electronic component operably coupled to the electronic component portion.