Liquid Immersion Cooling Sheet With Porous Structure
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current cooling methods, such as air-based heat conduction and liquid immersion coolers, are inefficient in dissipating heat from electronic components due to low thermal conductivity and structural limitations, which can lead to increased component aging and reduced performance.
Innovation Solution
A liquid immersion cooling sheet with a metal case and a porous structure featuring gaps less than 0.2 mm, allowing for enhanced heat conduction and increased cooling surface area, integrated with a heat conduction plate for improved thermal performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If air is used as a heat conduction medium in traditional coolers, then the device structure is simple, but the thermal conductivity is too low to achieve good heat conduction efficiency
Solution Approach 1:
The patent introduces a liquid cooling medium as an intermediary substance to replace air as the heat conduction medium. The liquid cooling sheet flows through channels in contact with the heat-generating component, efficiently transferring heat away from the component. This intermediary liquid medium resolves the contradiction by providing superior thermal conductivity compared to air while maintaining a manageable device structure through integrated cooling channels.
2Reliability
If a liquid immersion cooler is used to improve heat dissipation, then the heat conduction efficiency increases, but the heat dissipation capacity is limited by structural constraints
Solution Approach 1:
The patent employs a porous structure within the liquid cooling sheet that allows for enhanced heat dissipation. The porous configuration increases the surface area for heat transfer while maintaining structural integrity and enabling efficient liquid flow pathways. This porous material approach resolves the contradiction by improving heat conduction efficiency without imposing excessive structural constraints, as the porous structure naturally facilitates fluid circulation.
3Reliability
If the cooling surface area is increased to improve heat dissipation, then the thermal performance improves, but the manufacturing complexity increases
Solution Approach 1:
The patent transitions from a conventional two-dimensional cooling surface to a three-dimensional porous structure within the liquid cooling sheet. This dimensional change allows the cooling surface area to be significantly increased throughout the volume of the material rather than just on the surface. The 3D porous architecture provides extensive heat transfer surface area while maintaining a compact overall form factor, thereby improving thermal performance without proportionally increasing manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The cooling sheet effectively dissipates waste heat from electronic components by increasing the cooling surface area and facilitating liquid flow, thereby maintaining optimal operating temperatures and simplifying manufacturing processes.
Implementation Method 1
The porous structure is disposed on the cooling surface and has multiple gaps. A width of each gap is less than or equal to about 0.2 mm
Implementation Method 2
The metal case has a heated surface and a cooling surface formed on a back of the heated surface
Data Source
AI summary
A liquid immersion cooling sheet includes a metal case and a porous structure. The metal case has a heated surface and a cooling surface formed on a back of the heated surface. The porous structure is disposed on the cooling surface and has multiple gaps. A width of each gap is less than or equal to about 0.2 mm. Therefore, the waste heat from an electronic heat source may be rapidly dissipated.