Structured Porous Metal Layer Adhesion Control
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Solution Overview
Problem
The integration of thick porous metal layers in semiconductor and solar industries is hindered by the difficulty in structuring them using conventional methods, limiting their applications due to poor adhesion and removal challenges.
Innovation Solution
A method involving a workpiece with distinct regions of different surface characteristics, where one region has strong adhesion and the other has weak adhesion to a porous metal layer, allowing for easy removal of the layer from the weak adhesion area without the use of masks or etching, achieved by surface treatment and material selection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stress or pressure
If porous metal layers are deposited using plasma-based deposition methods, then favorable stress properties are achieved, but structuring of thick layers becomes difficult
Solution Approach 1:
The substrate surface is divided into first regions and second regions with different surface characteristics. The porous metal layer is deposited over the entire surface, but selectively adheres to different regions. This segmentation allows easy removal from second regions while maintaining adhesion to first regions, solving the structuring difficulty without compromising stress properties.
Solution Approach 2:
Different regions of the substrate are given different surface characteristics (first regions with high adhesion, second regions with low adhesion). This local differentiation enables selective retention or removal of the porous metal layer in specific areas, achieving structuring capability while preserving the favorable stress properties of the porous layer.
2Ease of manufacture
If conventional deposition methods are used, then metal layers can be deposited, but stress is induced on the substrate which is undesirable
Solution Approach 1:
A porous metal layer is deposited using plasma-based deposition methods instead of conventional methods. The porous structure inherently reduces stress on the substrate while maintaining deposition capability. The layer can be selectively removed from second regions due to low adhesion, further stress management.
3Stress or pressure
If porous metal layers are used, then favorable stress properties are achieved, but integration in manufacturing processes is hindered
Solution Approach 1:
The substrate is segmented into first and second regions with different surface characteristics before deposition. This pre-segmentation simplifies process integration by enabling selective adhesion and easy removal from second regions, eliminating complex structuring steps while maintaining the favorable stress properties of the porous layer.
Solution Approach 2:
Surface treatment is performed in advance to create first regions and second regions with different adhesion properties before depositing the porous metal layer. This preliminary action simplifies subsequent processing steps and facilitates easy integration into manufacturing processes while preserving stress benefits.
4Reliability
If thick porous metal layers are deposited, then favorable properties are achieved, but structuring becomes difficult with common methods
Solution Approach 1:
The substrate surface is segmented into first regions (high adhesion) and second regions (low adhesion). Thick porous metal layers are deposited over the entire surface, but easily removed from second regions due to low adhesion, enabling structuring of thick layers without compromising adhesion reliability in first regions.
Solution Approach 2:
Different local regions are given different adhesion qualities. Second regions have low adhesion to facilitate easy removal of thick porous layers, while first regions maintain high adhesion for reliable retention. This local quality differentiation solves the structuring difficulty for thick layers.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the structuring of porous metal layers with favorable stress and electrical properties, improving manufacturing efficiency and expanding application ranges by ensuring strong adhesion where needed and easy removal where not, thus reducing manufacturing costs and stress-induced wafer bending.
Implementation Method 1
an adhesive force between the second region and the porous metal layer is lower than an adhesive force between the first region and the porous metal layer
Data Source
AI summary
A method for processing a workpiece may include: providing a workpiece including a first region and a second region; forming a porous metal layer over the first region and the second region; wherein the first region and the second region are configured such that an adhesive force between the second region and the porous metal layer is lower than an adhesive force between the first region and the porous metal layer.