Portable Unit Process Apparatus for Flexible Semiconductor Manufacturing
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Solution Overview
Problem
Current semiconductor manufacturing systems face challenges in efficiently handling variable-product, variable-quantity production due to high costs, complex control systems, and the need for large, immovable equipment, which results in low productivity and high facility investments, making it difficult to incorporate research and development into actual manufacturing lines.
Innovation Solution
A device manufacturing apparatus comprising portable, sealed-type unit process apparatuses, a sealed conveyance container, and conveyance means, allowing flexible arrangement according to the order of processes, enabling efficient handling of variable-product, variable-quantity production without the need for a large clean room, reducing equipment and maintenance costs, and improving energy efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a job shop system with multiple bays is used to handle variable-product variable-quantity production, then manufacturing flexibility is improved, but conveyance distance and waiting time increase substantially
Solution Approach 1:
The manufacturing system is divided into multiple independent modular units (processing chambers, conveyance robots, transfer mechanisms) that can be reconfigured. Each unit performs a specific function and can be independently controlled, allowing the system to adapt to different production requirements without requiring complete rearrangement of the entire facility.
Solution Approach 2:
The system employs dynamic conveyance paths and flexible transfer mechanisms that can adapt their operation based on real-time production demands. The conveyance robots and transfer mechanisms can dynamically adjust their movement patterns and timing to optimize throughput while minimizing waiting time, rather than following fixed rigid paths.
2Productivity
If a flow shop system with fixed apparatus arrangement is used to reduce conveyance distance, then productivity is improved, but adaptability to product changes deteriorates
Solution Approach 1:
The processing chambers and equipment are designed with universal interfaces and standardized configurations that allow them to handle multiple product types and process variations. The system can switch between different products by reconfiguring parameters and sequences rather than physically rearranging equipment, maintaining both high productivity and adaptability.
Solution Approach 2:
The system maintains a fixed physical layout for productivity but achieves adaptability through dynamic control of process parameters, conveyance sequences, and operational modes. The fixed apparatus arrangement is complemented by flexible software control that can adapt to different products without requiring physical reconfiguration.
3Manufacturing precision
If huge semiconductor processing apparatus are fixed in a closed clean room to ensure manufacturing quality, then manufacturing precision is improved, but device complexity and facility investment increase
Solution Approach 1:
The clean room environment is segmented into multiple isolated processing chambers, each maintaining controlled conditions independently. This allows the system to achieve high manufacturing precision in each chamber without requiring an excessively large overall facility, as each chamber is a self-contained controlled environment.
Solution Approach 2:
The critical clean room environment is extracted and contained within individual processing chambers rather than requiring the entire facility to be a massive clean room. This reduces overall facility complexity and scale while maintaining the necessary precision environments where they are actually needed - in the processing chambers themselves.
4Adaptability or versatility
If the number of processes and apparatuses is increased to handle more product types, then adaptability is improved, but conveyance time and wafer in progress increase dramatically
Solution Approach 1:
Multiple processing functions are merged into integrated modular units that combine several operations within single chambers or closely coupled units. This reduces the total number of separate apparatuses and conveyance steps needed to handle multiple product types, thereby reducing conveyance time and wafer in progress while maintaining adaptability.
Data Source
AI summary
A device manufacturing method and a device manufacturing apparatus in a single wafer processing system with wafers in 0.5 inch size. A large number of sealed-type unit process apparatuses are arranged to form a manufacturing line. The unit process apparatus is portable and processes a single process in the manufacturing process. When the number of a unit of manufacturing is more than the number of the unit process apparatuses, the unit process apparatuses are arranged as a flow shop system, corresponding to the order of processes for the device. When the number of the units is nearly equal to the number of processes, the apparatuses are arranged as a class shop system for classified arrangement at every major division of orders of processes. When the number of the units is far less than the number of processes, the apparatuses are arranged as a multicell shop system.