Position-Based Rendering for Multi-Die GPU Scalability

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

As graphics processors scale to larger die sizes, integrating multiple silicon dies into a single cohesive unit for improved manufacturability, scalability, and power delivery poses challenges related to interconnects and performance optimization, with existing methods like alternate frame rendering (AFR) and split frame rendering (SFR) falling short in achieving optimal performance across multiple dies.

Innovation Solution

The implementation of a graphics processor architecture that utilizes position-based rendering techniques, including checkerboard tiling and work partitioning across multiple GPUs, to efficiently manage shading work and improve performance by optimizing the allocation of position-only shading and tile-based shading tasks.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If multiple silicon dies are integrated into a single cohesive unit, then manufacturability and scalability are improved, but interconnect challenges and performance optimization become more difficult

Engineering Contradiction:
ImprovescalabilityVSAvoidinterconnect challenges
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The rendering workload is segmented into position-only shading and tile-based shading components, allowing each die to specialize in specific rendering tasks. This segmentation enables independent optimization of each die's interconnect requirements while maintaining overall system scalability.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent introduces a new dimension of work distribution by separating rendering tasks based on their computational characteristics (position-only vs. tile-based shading) rather than traditional spatial or temporal dimensions. This allows for optimized interconnect usage patterns that match the specific communication needs of each shading type.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Use of energy by moving object

If multiple silicon dies are integrated into a single cohesive unit, then power delivery is improved, but interconnect challenges and performance optimization become more difficult

Engineering Contradiction:
Improvepower deliveryVSAvoidinterconnect challenges
Core Design Contradiction:
Use of energy by moving objectVSDevice complexity

Solution Approach 1:

Each die is assigned specific rendering workloads based on its local capabilities and interconnect characteristics. Position-only shading is distributed to dies optimized for that task, while tile-based shading is assigned to dies with appropriate resources, creating local quality optimization that reduces overall interconnect complexity.

Inventive Principle:
Principle #3Local quality

3Productivity

If position-based rendering with checkerboard tiling is implemented, then shading work distribution is improved, but device complexity increases

Engineering Contradiction:
Improveshading work distributionVSAvoiddevice complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The rendering workload is segmented into position-only shading and tile-based shading components, allowing each die to specialize in specific rendering tasks. This segmentation enables independent optimization of each die's interconnect requirements while maintaining overall system scalability.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The system dynamically distributes rendering work between multiple dies based on workload characteristics and die capabilities. The work partitioning is flexible and can be adjusted based on runtime conditions, improving productivity without requiring static complex configurations.

Inventive Principle:
Principle #15Dynamics

4Productivity

If work is partitioned across multiple GPUs, then performance and scalability are improved, but interconnect requirements and coordination complexity increase

Engineering Contradiction:
ImproveperformanceVSAvoidcoordination complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The patent changes the parameter of work distribution by separating rendering tasks based on their computational characteristics (position-only vs. tile-based shading) rather than traditional spatial or temporal dimensions. This allows for optimized interconnect usage patterns that match the specific communication needs of each shading type.

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentUS11710269B2Position-based rendering apparatus and method for multi-die/GPU graphics processing
Publication Date: 2023.07.25 INTEL CORP
  • US11710269B2 patent drawing
  • US11710269B2 patent drawing
  • US11710269B2 patent drawing

AI summary

Position-based rendering apparatus and method for multi-die/GPU graphics processing. For example, one embodiment of a method comprises: distributing a plurality of graphics draws to a plurality of graphics processors; performing position-only shading using vertex data associated with tiles of a first draw on a first graphics processor, the first graphics processor responsively generating visibility data for each of the tiles; distributing subsets of the visibility data associated with different subsets of the tiles to different graphics processors; limiting geometry work to be performed on each tile by each graphics processor using the visibility data, each graphics processor to responsively generate rendered tiles; and wherein the rendered tiles are combined to generate a complete image frame.