Positive Resist Composition Using High Boiling Point Alcohol Solvent
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Solution Overview
Problem
In the double patterning process for semiconductor and liquid crystal display element production, positive resist compositions face issues with solubility and storage stability when using alcohol-based solvents, leading to poor workability and shape deterioration of resist patterns.
Innovation Solution
A positive resist composition is developed using an alcohol-based organic solvent with a boiling point of at least 150°C, incorporating a base component that becomes soluble in an alkali developing solution upon acid exposure, ensuring minimal adverse effects on the first resist pattern and improved workability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional positive resist composition using alcohol-based solvent is used, then the resist material can be dissolved in the developing solution, but the solubility is poor and storage stability is poor
Solution Approach 1:
The patent changes the parameter of solvent boiling point by specifying an alcohol-based organic solvent with a boiling point of at least 150°C. This parameter change resolves the contradiction by improving both storage stability and solubility simultaneously, as higher boiling point solvents provide better thermal stability and maintain solubility characteristics.
2Manufacturing precision
If a first resist pattern is formed and then a second resist composition is applied, then double patterning can be achieved, but the first resist pattern dissolves causing thickness loss and shape deterioration
Solution Approach 1:
The patent employs a freezing agent as a temporary protective layer that is discarded after serving its protective function. The freezing agent forms a protective film on the first resist pattern, preventing dissolution during the application of the second resist composition, and is then removed in the subsequent heating step, allowing the double patterning process to proceed with preserved pattern integrity.
Solution Approach 2:
The freezing agent is applied beforehand to cushion or protect the first resist pattern from adverse effects. This protective film prevents the solvent of the second resist composition from directly contacting and dissolving the first resist pattern, thereby preventing thickness loss and shape deterioration during the double patterning process.
3Shape
If a freezing agent is used to protect the first resist pattern, then shape deterioration is prevented, but the number of steps increases and workability decreases
Solution Approach 1:
The patent merges multiple functions into the freezing agent application step. The freezing agent not only protects the first resist pattern from dissolution but also serves as a source of acid during heating, which is necessary for the chemically amplified resist process. This combination of functions reduces the number of separate steps and improves workability while maintaining pattern shape integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides excellent solubility and high-resolution resist patterns with improved workability, eliminating the need for freezing agents and enhancing the stability of the resist composition.
Implementation Method 1
a base component (A) which exhibits increased solubility in an alkali developing solution under the action of acid
Implementation Method 2
an acid-generator component (B) which generates acid upon exposure
Implementation Method 3
dissolved in an organic solvent (S), wherein the organic solvent (S) includes an alcohol-based organic solvent having a boiling point of at least 150° C.
Data Source
AI summary
A positive resist composition including: a base component (A) which exhibits increased solubility in an alkali developing solution under the action of acid; and an acid-generator component (B) which generates acid upon exposure; dissolved in an organic solvent (S), the organic solvent (S) including an alcohol-based organic solvent having a boiling point of at least 150° C.; and a method of forming a resist pattern including: applying the positive resist composition on a substrate on which a first resist pattern is formed to form a second resist film; and subjecting the second resist film to selective exposure and alkali developing to form a resist pattern.