Positive Resist Composition for Double Patterning
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Solution Overview
Problem
In double patterning processes, the first resist pattern formed using a positive resist composition is often dissolved or mixed with the second resist composition, leading to unsatisfactory resist pattern formation due to incompatibility and solubility issues, particularly when using organic solvents with low compatibility.
Innovation Solution
A positive resist composition is developed that includes a resin component with specific structural units and an acid-generator component, dissolved in an organic solvent that does not dissolve the first resist film, allowing for selective exposure and development to form a resist pattern without dissolving the initial pattern.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a positive resist composition is used for the second patterning in double patterning, then the same resist type can be used for both patterning steps, but the first resist pattern is dissolved or mixed with the second resist composition, leading to unsatisfactory resist pattern formation
Solution Approach 1:
The patent applies local quality by designing the second resist composition with specific local characteristics: using a solvent that does not dissolve the first resist pattern (non-aqueous solvent like cyclohexanone or ethyl lactate) while maintaining the positive resist functionality. This allows the second resist to be applied without dissolving the first pattern, enabling sequential patterning with the same resist type.
Solution Approach 2:
The patent changes the solvent parameter of the second resist composition from aqueous to non-aqueous to resolve the solubility conflict. By adjusting the solvent type parameter, the second resist can be applied without dissolving the first resist pattern, while still achieving the desired positive resist patterning effect in the second step.
2Stability of the object's composition
If an organic solvent with low compatibility is used in the second resist composition, then the first resist pattern stability is improved, but the solubility and processability of the second resist composition deteriorates
Solution Approach 1:
The patent changes the solvent parameter from aqueous to specific non-aqueous solvents (cyclohexanone, ethyl lactate, etc.) to achieve the right balance. These solvents have low solubility for the first resist pattern (improving stability) but maintain good processability for the second resist composition through appropriate molecular structure and polarity characteristics.
Solution Approach 2:
The second resist composition uses a composite approach by combining the positive resist polymer with specific non-aqueous solvents and additives that enhance both stability and processability. The composite formulation achieves compatibility between the first and second resist layers while maintaining manufacturability.
3Device complexity
If the same positive resist composition is used for both patterning steps, then the process complexity is reduced, but the first resist pattern is dissolved by the second resist composition, leading to mixing and unsatisfactory pattern formation
Solution Approach 1:
The patent applies local quality by making the second resist composition locally different from the first - specifically in the solvent component - while keeping the overall positive resist nature the same. This allows the same resist type to be used for both steps (simplicity) while the local solvent difference prevents dissolution (reliability).
Solution Approach 2:
The patent changes the solvent parameter of the second resist composition to a non-aqueous type, which fundamentally alters the interaction with the first resist pattern. This parameter change enables the use of the same positive resist type for both patterning steps without dissolution or mixing issues.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables the formation of a resist pattern through double patterning without dissolving the first resist pattern, improving the stability and quality of the resist pattern formed.
Implementation Method 1
an acid-generator component (B) which generates acid upon exposure
Implementation Method 2
the resin component (A) and the acid-generator component (B) being dissolved in the organic solvent (S)
Data Source
AI summary
A positive resist composition used to form a second resist film in a method of forming a positive resist pattern, including: applying a positive resist composition on the substrate on which a first resist pattern formed of a first resist film is formed to form a second resist film; and selectively exposing the second resist film and alkali-developing the second resist film to form a resist pattern; whereinthe positive resist composition includes a resin component (A) having a structural unit (a0-1) represented by general formula (a0-1) and a structural unit (a0-2) represented by general formula (a0-2), which exhibits increased solubility in an alkali developing solution under action of acid, an acid-generator component (B) which generates acid upon exposure, and an organic solvent (S) which does not dissolve the first resist film, and the resin component (A) and the acid-generator component (B) are dissolved in the organic solvent (S).