Posture Changing Robot for Substrate Treating Apparatus

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Solution Overview

Problem

Current substrate treatment methods face challenges in achieving high mass productivity, uniform processing quality, minimizing pattern leaning and watermark occurrence, especially when dealing with substrates having high aspect ratio patterns, as they either suffer from low productivity and non-uniformity in single-wafer type methods or pattern leaning and watermark risks in batch type methods.

Innovation Solution

A substrate treating apparatus and method that includes a processing tank, a support member for vertical substrate positioning, and a posture changing robot capable of transforming the substrate from a vertical to a horizontal posture while immersed, using a hand and arm mechanism controlled to rotate and move linearly, ensuring efficient processing and minimizing watermarks and pattern leaning.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If batch type treating method is used to improve mass productivity, then productivity is improved, but pattern leaning occurs when substrate is lifted

Engineering Contradiction:

Improvemass productivityVSAvoidpattern leaning

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

The substrate is rotated to a horizontal posture before being taken out of the processing tank, in advance of the lifting operation. This preliminary posture change prevents pattern leaning from occurring when the substrate is subsequently lifted, while still maintaining the batch processing productivity advantage.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The substrate posture is dynamically changed from vertical to horizontal during the processing sequence. This dynamic adjustment allows the substrate to be processed in a horizontal orientation that prevents pattern leaning, while the overall batch processing methodology maintains high productivity.

Inventive Principle:

Principle #15Dynamics

2Productivity

If batch type treating method is used to improve mass productivity, then productivity is improved, but watermark may be generated when multiple substrates are exposed to air simultaneously

Engineering Contradiction:

Improvemass productivityVSAvoidwatermark formation

Core Design Contradiction:

ProductivityVSObject-affected harmful factors

Solution Approach 1:

The substrate is rotated to horizontal posture and dried before being taken out of the processing tank. This preliminary drying action prevents watermark formation upon exposure to air, while the batch processing approach maintains mass productivity.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The drying process is performed continuously on multiple substrates in batch while they remain in the processing tank, before removal. This continuous useful action ensures all substrates are dried simultaneously, preventing watermark formation while maintaining productivity.

Inventive Principle:

Principle #20Continuity of useful action

3Manufacturing precision

If single-wafer type treating method is used to avoid pattern leaning, then manufacturing precision is improved, but mass productivity is reduced

Engineering Contradiction:

Improvepattern leaning preventionVSAvoidmass productivity

Core Design Contradiction:

Manufacturing precisionVSProductivity

Solution Approach 1:

The invention merges the advantages of both batch processing (high productivity) and single-wafer processing (precise posture control). Multiple substrates are processed together in batch, but each substrate's posture is precisely controlled and rotated to horizontal, combining the benefits of both methods.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The processing system is designed to handle multiple substrates simultaneously (batch capability) while providing individual posture control for each substrate (precision capability). This multi-functional approach achieves both high productivity and precise pattern leaning prevention.

Inventive Principle:

Principle #6Universality (Multi-functionality)

4Manufacturing precision

If single-wafer type treating method is used to improve uniformity of processing quality, then processing quality uniformity is improved, but mass productivity is reduced

Engineering Contradiction:

Improveprocessing quality uniformityVSAvoidmass productivity

Core Design Contradiction:

Manufacturing precisionVSProductivity

Solution Approach 1:

The invention combines batch processing (multiple substrates simultaneously) with uniform posture control and drying. All substrates receive the same treatment sequence and posture adjustment, ensuring processing quality uniformity across all substrates while maintaining mass productivity through parallel processing.

Inventive Principle:

Principle #5Merging (Combining)

Data Source

PatentUS20230110780A1Apparatus and method of treating substrate

Publication Date: 2023.04.13 SYSTEM ENGINEERING MEGA SOLUTION CO LTD

AI summary

The present invention provides an apparatus for treating a substrate, the apparatus including: a processing tank having an accommodation space in which a processing liquid is accommodated; a support member for supporting at least one substrate in the receiving space in a vertical posture; and a posture changing robot for changing a posture of the substrate in a state of being immersed in the liquid state from the vertical posture to a horizontal posture, in which wherein the posture changing robot includes: a hand configured to grip the substrate; and an arm for moving the hand.