Power Amplifier Air Bridge Grounding for Low Inductance
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Solution Overview
Problem
Conventional high-frequency amplifying devices face a decrease in gain due to increased inductance caused by long distances between isolated source electrodes and via holes, which is exacerbated by the use of air bridges for grounding.
Innovation Solution
The power amplifying device incorporates a direct gold conductor air bridge that connects the inner source electrode to earth parts at the shortest distance, minimizing inductance by reducing the length of connection bridges and ensuring all isolated source electrodes are grounded at equal and shortest distances.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If air bridge is used to ground isolated source electrode, then grounding is achieved, but distance from source electrode to via holes becomes long causing inductance increase and gain decrease
Solution Approach 1:
The patent transitions from planar grounding connection to three-dimensional vertical connection by introducing via holes that extend downward from the surface. This dimensional change allows the air bridge to connect the isolated source electrode directly to ground points in the vertical dimension, dramatically reducing the horizontal distance and associated inductance while maintaining effective grounding.
Solution Approach 2:
The air bridge serves as an intermediary component that directly connects the isolated source electrode to the via holes, providing a low-inductance path to ground. This intermediary structure eliminates the need for long lateral connections and enables direct vertical grounding through the via holes.
2Power
If number of power amplifying elements is increased to obtain high gain, then amplification capability is improved, but isolated source electrodes increase causing more grounding issues and inductance
Solution Approach 1:
The patent merges multiple isolated source electrodes into a common grounding structure where multiple via holes converge to a shared ground point. This consolidation allows multiple amplifying elements to be grounded through a unified low-inductance path, reducing the overall grounding complexity while maintaining the high gain capability of multiple parallel elements.
Solution Approach 2:
By utilizing the vertical dimension with via holes, the patent provides a scalable grounding solution that can accommodate any number of parallel amplifying elements. Each source electrode can be independently connected to ground through its own via hole, and all via holes can be distributed in the vertical plane without increasing lateral trace lengths, thus managing complexity while maintaining performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces the influence of inductance, thereby maintaining or improving the gain of the high-frequency amplifying device even when the number of isolated source electrodes increases.
Implementation Method 1
an air bridge which directly connects the inner source electrode and the earth parts
Data Source
Figure 1
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Figure 4~5
AI summary
A power amplifying device (100) includes earth parts (12) which are connected with via holes (12A) for grounding, source electrode earth conductors (13) which connect the earth parts, source electrodes (13A) which are coupled to the source electrode earth conductors, an inner source electrode which is not in contact with the source electrode earth conductors, a drain electrode (14), a gate electrode (15) and an air bridge (120) which directly connects the inner source electrode and earth parts.